Abstract: A method for manufacturing printed electrical circuits which comprise a substrate and copper foil applied thereto by hot embossing in a predetermined circuit pattern, said method comprising(a) providing a laminate which comprises the sequence of a printed circuit substrate, a heat activated adhesive layer, a copper foil and a carrier film which is electrically conductive,(b) passing an electrical current between two electrodes and through the carrier film wherein one electrode has sufficiently large film contact area whereby substantially no resistance heating results from the current density and the other electrode serves as an embossing tool and is of sufficiently small film contact area whereby sufficient resistance heating results from the current density to activate the adhesive layer to bond the copper foil to the substrate in the pattern of said other electrode, and(c) removing from the laminate the carrier film and such copper foil overlying areas where the adhesive was not heat activated thereby leav