Patents Assigned to BC Components Holdings B.V.
  • Patent number: 6998220
    Abstract: A method for manufacturing thin-film chip resistors, in which method a resistor layer (14) and a contact layer (15, 16) are applied onto the upper surface of a substrate (10) and structured using laser light so as to form on said substrate (10) a plurality of adjacent, separate resistor lands (24) having a predetermined approximate resistance value, allows the simplified and cheap manufacturing by performing the electrical insulation of the resistor elements (24) and the structuring of the individual resistor lands (24) for the entire resistor land simultaneously by means of a laser-lithographic direct exposure method.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: February 14, 2006
    Assignee: BC Components Holdings B.V.
    Inventors: Wolfgang Werner, Horst Wolf, Reiner Wilhelm Kuehl
  • Patent number: 6370016
    Abstract: Improved covers for electrolytic capacitors, offering both durability and low extractability of halides by high temperature electrolytes, can be produced from molding compositions comprising thermoset polymers having low halide extractability, preferably based on materials such as phenolic resins, and nonporous fillers, the compositions preferably being essentially free of porous fillers.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: April 9, 2002
    Assignee: BC Components Holdings B.V.
    Inventors: James L. Stevens, Roland F. Dapo
  • Patent number: 6197241
    Abstract: Improved covers for electrolytic capacitors, offering both durability and low extractability of halides by high temperature electrolytes, can be produced from molding compositions including thermoset polymers having low halide extractability, preferably based on materials such as phenolic resins, and nonporous fillers, the compositions preferably being essentially free of porous fillers.
    Type: Grant
    Filed: August 6, 1997
    Date of Patent: March 6, 2001
    Assignee: BC Components Holdings B.V.
    Inventors: James L. Stevens, Roland F. Dapo
  • Patent number: 6150918
    Abstract: Degaussing units in the form of mono and duo-PTCs are disclosed which can be exposed to high inrush currents without the same leading to fracture at the edges of the ceramic thermistors. The electrode layers of the thermistor(s) completely cover the main surfaces and are composed of a material which comprises a silver alloy containing minimally 4 wt. % and maximally 12 wt. % zinc, and which is applied directly on to the thermistor by means of screen printing. In a preferred embodiment, an alloy containing approximately 6 wt. % zinc is used.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: November 21, 2000
    Assignee: BC Components Holdings B.V.
    Inventor: Reinhilde P. M. Berger
  • Patent number: 5997771
    Abstract: An electrolytic solution is comprised of a borate, at least one dicarboxylic acid and at least one hydrotropic agent. The hydrotropic agent serves to maintain soluability at low temperatures, for example, in glycol type solvents. The invention also provides use of 1,10 dodecanedioic acid or dimer acid, thus improving the cost of the electrolyte is improved over use of branched chain dicarboxylic acids, while the use of the hydrotropic agent maintains solubility at acceptable temperatures.
    Type: Grant
    Filed: December 16, 1998
    Date of Patent: December 7, 1999
    Assignee: BC Components Holdings B.V.
    Inventors: Roland F. Dapo, James L. Stevens
  • Patent number: 5921820
    Abstract: In this Application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.
    Type: Grant
    Filed: September 23, 1997
    Date of Patent: July 13, 1999
    Assignee: BC Components Holdings B.V.
    Inventor: Ruurd Dijkstra