Abstract: A pattern metallizing procedure is described wherein aluminum or other metal is deposited in a desired pattern on a polymeric material or other material web. The metal is charged with one polarity while a backing roll contacting the web is provided with regions charged with the opposite polarity to attract metal and with regions charged with the same polarity to repulse metal.

Abstract: Demetallizing method and apparatus capable of high speed continuous production of selectively patterned metallized polymeric film useful in packaging products are disclosed. Aqueous etchant solution is spray applied to the metallized surface having a pattern of etchant-resistant material applied thereto, the spent etchant solution is spray washed from the surface, and the washed web is dried by hot air drying. Etchant removes metal from exposed areas of the surface of the film while leaving the pattern unaffected, so as to provide a desired visible pattern.