Patents Assigned to BENCHMARK ELECTRONICS, INC.
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Publication number: 20230352805Abstract: A Substrate Integrated Wave (SIW) coupled to a Suspended Substrate Stripline (SSS) filter for introducing a notch response has a substrate having metal layers formed on a top surface and a bottom surface thereof. A filter circuit is formed on the top surface of the substrate. A top ground plate is provided and has an air cavity formed on a bottom surface of the top ground plate. The air cavity on the top ground plate is positioned directly above the filter circuit when the top ground plate is positioned on the top surface of the substrate. A bottom ground plate is provided and has an air cavity formed on a top surface of the bottom ground plate. The air cavity on the bottom ground plate is positioned directly below the filter circuit when the bottom ground plate is positioned on the bottom surface of the substrate. A SIW cavity resonator is coupled to the filter circuit by means of an aperture to create a notch response in the SSS filter.Type: ApplicationFiled: May 2, 2022Publication date: November 2, 2023Applicant: BENCHMARK ELECTRONICS, INC.Inventor: Francisco Iwao Hirata
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Patent number: 11510170Abstract: A method for forming a collaborative wireless sensor array comprising: connecting a plurality of wireless sensor nodes together, wherein each of the plurality of wireless sensor nodes wirelessly communicate with one another; collecting data by the plurality of wireless sensor nodes; forming metadata on the data collected by each of the plurality of wireless sensor nodes; sharing the data and metadata with the plurality of wireless sensor nodes; and fusing the data and metadata to perform a task.Type: GrantFiled: December 21, 2018Date of Patent: November 22, 2022Assignee: Benchmark Electronics, INC.Inventor: Jim Luecke
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Patent number: 11476591Abstract: An antenna assembly has a dielectric substrate. A plurality of end fire antennas in a Yagi-Uda configuration is positioned around edges of the dielectric substrate.Type: GrantFiled: September 9, 2020Date of Patent: October 18, 2022Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Rajveer Singh Brar, Mark Felipe
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Patent number: 11406010Abstract: A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.Type: GrantFiled: June 9, 2020Date of Patent: August 2, 2022Assignee: Benchmark Electronics, Inc.Inventors: Michael D. McCulley, Michelle C. Howard
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Patent number: 11350381Abstract: A method for establishing timing and processing of network messages in a wireless ad-hoc network comprising: establishing a network identification (ID) when the wireless ad-hoc network is unestablished; and establishing a local timing in the wireless ad-hoc network, the local timing having a network data frame structure, each network data frame in the network data frame structure having a plurality of network slot times, wherein each network slot time is designated as one of an assigned network slot time or a shared network slot time, each wireless node in the wireless ad-hoc network designated as one of an assigned wireless node or an unassigned wireless node, each assigned wireless node initiating and transmitting network messages in a corresponding assigned network slot time or any available shared network slot time, and each unassigned wireless node initiating and transmitting network messages only in any available shared network slot time.Type: GrantFiled: July 20, 2018Date of Patent: May 31, 2022Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Hiep Truong, Kevin Nguyen
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Patent number: 10993201Abstract: A method for location aware networking in a wireless ad-hoc network having a plurality of wireless nodes in a geographic area comprising: dividing the geographic area into a plurality of grids; determining a location of a particular wireless node; determining a corresponding grid where the particular wireless node resides; determining a cluster head for the corresponding grid; connecting corresponding wireless nodes in the corresponding grid to the cluster head, wherein the cluster head of the corresponding grid periodically gather data from the corresponding wireless nodes, aggregate the data and transmits the data to a gateway; and coupling the cluster head of the corresponding grid to cluster heads of each of the plurality of grids forming a pathway to the gateway, the cluster head of the corresponding grid transmitting the data through the pathway or directly to the gateway.Type: GrantFiled: December 21, 2018Date of Patent: April 27, 2021Assignee: BENCHMARK ELECTRONICS, INC.Inventor: Jim Luecke
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Publication number: 20210112656Abstract: A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.Type: ApplicationFiled: June 9, 2020Publication date: April 15, 2021Applicant: BENCHMARK ELECTRONICS, INC.Inventors: MICHAEL D. MCCULLEY, MICHELLE C. HOWARD
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Patent number: 10972997Abstract: A method for interference avoidance when transmitting a message in a wireless system comprising: dividing a frame into a plurality of time slots, wherein a first plurality of time slots allocated as Time Division Multiple Access (TDMA) time slots and a second plurality of time slots allocated as contention slots; transmitting a message in a designated TDMA time slot by a corresponding wireless node assigned to the designated TDMA time slot if the designated TDMA time slot is idle; and transmitting the message in a contention slot if the designated TDMA time slot is busy.Type: GrantFiled: December 21, 2018Date of Patent: April 6, 2021Assignee: BENCHMARK ELECTRONICS, INC.Inventor: Jim Luecke
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Patent number: 10916823Abstract: A device having a stripline to substrate integrated waveguide (SIW) transition structure has a substrate having a top surface and a bottom surface. A first metal ground layer is formed on the top surface of the substrate. A second metal ground layer is formed on the bottom surface of the substrate. A set of metallic vias are used to connect both ground layers. The stripline to SIW transition structure is embedded within the substrate between the first metal ground layer and the second metal ground layer. The stripline to SIW transition structure has a first transmission line embedded within the substrate. An impedance transformer is coupled to one end of the first transmission line. A coupling structure is coupled to the impedance transformer. The coupling structure has a pair of transmission lines. The pair of transmission lines diverge outward and upward from the impedance transformer.Type: GrantFiled: September 26, 2019Date of Patent: February 9, 2021Assignee: BENCHMARK ELECTRONICS, INC.Inventor: Francisco Iwao Hirata
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Publication number: 20210028556Abstract: An antenna assembly has a dielectric substrate. A plurality of end fire antennas in a Yagi-Uda configuration is positioned around edges of the dielectric substrate.Type: ApplicationFiled: September 9, 2020Publication date: January 28, 2021Applicant: BENCHMARK ELECTRONICS, INC.Inventors: RAJVEER SINGH BRAR, MARK FELIPE
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Publication number: 20200326700Abstract: A payload transport system has a plurality of unmanned aerial vehicles (UAVs). The payload is fractionated into a plurality of components wherein each of the plurality of components is coupled to one of the plurality of UAVs, wherein each of the plurality of components wirelessly communicating to function as the payload.Type: ApplicationFiled: May 12, 2020Publication date: October 15, 2020Applicant: BENCHMARK ELECTRONICS, INC.Inventor: JIM LUECKE
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Patent number: 10756926Abstract: A system for transmitting video and Controller Area Network (CAN) data over a slip ring assembly has a first Ethernet/CAN transceiver converting CAN signals with control data to Ethernet signals with the control data. A first modem converts the ethernet signal with the control data to tone sets and transmits the tone sets over the slip ring assembly. A second modem receives and demodulates the tone sets into the Ethernet signals with the control data. A second Ethernet/CAN transceiver converts the Ethernet signals with the control data to the CAN signals with the control data.Type: GrantFiled: July 29, 2019Date of Patent: August 25, 2020Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Neil Keith Habermehl, Keith Heinzig
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Patent number: 10713958Abstract: A UAV landing system can include a landing pad defining a landing area including a target point; a plurality of positioning radio transmitters positioned in a spaced apart relation and equidistant from the target point, each radio transmitter transmitting a ranging signal; and a position determination and aircraft navigation system at the incoming UAV to receive the ranging signals; determine a range to each positioning radio using the received ranging signals; compute a position of the UAV relative to the target point; determine a course for the UAV to a point above the target point of the landing pad; fly the UAV to the point above the target point of the landing pad, and cause the aircraft to descend vertically toward the target point when the UAV reaches the point above the target point.Type: GrantFiled: June 13, 2017Date of Patent: July 14, 2020Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Ronald Hobbs, James Luecke
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Patent number: 10644468Abstract: Embodiments disclosed herein include devices and methods pertaining to medical lead connectors. According to various embodiments of the disclosed technology, disclosed is a lead connector that may include a base member; a flexible circuit disposed on the base member and including a plurality of electrical contacts; a plurality of contacts positioned to allow contact between a lead inserted into the lead connector and the plurality of contacts and between the plurality of contacts and the plurality of electrical contacts of the flexible circuit; and a casing that includes a bottom casing and a cover member. When a lead is inserted into the lead connector via an opening on the cover member, the lead may push against the plurality of contacts, electrically coupling the lead to the flexible circuit via the plurality of contacts and the plurality of electrical contacts of the flexible circuit.Type: GrantFiled: November 2, 2018Date of Patent: May 5, 2020Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Robert Raymond White, Daniel William Johns, Daniel Patrick Higgins
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Publication number: 20200119948Abstract: A system for transmitting video and Controller Area Network (CAN) data over a slip ring assembly has a first Ethernet/CAN transceiver converting CAN signals with control data to Ethernet signals with the control data. A first modem converts the ethernet signal with the control data to tone sets and transmits the tone sets over the slip ring assembly. A second modem receives and demodulates the tone sets into the Ethernet signals with the control data. A second Ethernet/CAN transceiver converts the Ethernet signals with the control data to the CAN signals with the control data.Type: ApplicationFiled: July 29, 2019Publication date: April 16, 2020Applicant: BENCHMARK ELECTRONICS, INC.Inventors: NEIL KEITH HABERMEHL, KEITH HEINZIG
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Patent number: 10608390Abstract: Embodiments disclosed herein include devices and methods pertaining to medical lead connectors. According to various embodiments of the disclosed technology, disclosed is a lead connector that may include a base member; a flexible circuit including a plurality of electrical contacts; a casing that includes a bottom casing and a cover member. The bottom casing may include receptacles open to a surface of the flexible circuit and aligned with electrical contacts on the flexible circuit. The cover member may include a slot opening to receive a lead stylet. Furthermore, the lead connector may include ball contacts positioned in the receptacles. When the lead stylet is inserted into the lead connector, the lead stylet may push the ball contacts downward to make electrical contact with the electrical contacts on the flexible circuit. A portion of the lead stylet may extend beyond an edge of the casing.Type: GrantFiled: May 15, 2018Date of Patent: March 31, 2020Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Robert Raymond White, Daniel William Johns, Daniel Patrick Higgins
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Publication number: 20200067183Abstract: An antenna assembly has a first antenna layer. A second antenna layer is spaced apart from the first antenna layer. A feed layer excites the first antenna layer and the second antenna layer. The feed layer is spaced apart from the second antenna layer. A reflective layer is spaced apart from the feed layer.Type: ApplicationFiled: September 19, 2019Publication date: February 27, 2020Applicant: BENCHMARK ELECTRONICS, INC.Inventor: ARKAJYOTI CHANG
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Patent number: 10564367Abstract: A fiber optic connector assembly has an MT connector. The MT connector has a housing. A first slot is formed in a front surface of the housing. The first slot extends across a width of the front surface of the housing and partially down a length of the housing. A pair of slots is formed in a rear surface of the housing. The pair of slots extends across a width of the rear surface of the housing and partially down the length of the housing. An aperture is formed through a side surface of the housing and between the pair of slots. The aperture extends completely through the housing. An opening is formed in a central area of the rear surface of the housing and in communication with the aperture. A channel is formed between the first slot and the aperture connecting the first slot to the aperture. At least one securing pin is formed within the first slot.Type: GrantFiled: October 18, 2018Date of Patent: February 18, 2020Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Kevin Jon Pitkin, Peter Everett Brooks, Mark Braithwaite
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Patent number: 10512054Abstract: A method for synchronization and time transfer in a wireless system having a single timing source comprises: transmitting a timing message from a coordinator node, wherein the coordinator node is coupled to the single timing source of the wireless system; detecting the timing message by a wireless node; and synchronizing the wireless node to a time on the timing message.Type: GrantFiled: May 17, 2018Date of Patent: December 17, 2019Assignee: BENCHMARK ELECTRONICS, INC.Inventors: Hiep Truong, Kevin Nguyen
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Publication number: 20190273602Abstract: A method for forming a chaotic permuted spread spectrum signal comprising: upsampling data from a data signal forming an upsampled data packet; and permuting the upsampled data package.Type: ApplicationFiled: March 18, 2019Publication date: September 5, 2019Applicant: BENCHMARK ELECTRONICS, INC.Inventors: HIEP TRUONG, JIM LUECKE