Patents Assigned to BGT MATERIALS LIMITED
  • Patent number: 11229922
    Abstract: A portable hydrogen-containing ozone water humidifier including a housing with a mist outlet, a water tank for storing water, a hydrogen-containing ozone water generator, an ultrasonic atomizer for converting water into mist, a rechargeable battery and an electronic controller is revealed. An outlet pipe is connected to the bottom of the water tank and the hydrogen-containing ozone water generator is disposed on the outlet pipe for hydrolysis of the water to generate oxygen and ozone gas at an anode plate and hydrogen gas at a cathode plate and further get disinfectant water formed by ozone water mixed with hydrogen-rich water while the ultrasonic atomizer is arranged at an outlet end of the outlet pipe. The rechargeable battery provides power to the electronic controller, the hydrogen-containing ozone water generator, and the ultrasonic atomizer for driving them to work. The humidifier is compact and easy to carry.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: January 25, 2022
    Assignee: BGT MATERIALS LIMITED
    Inventors: Kuo-Hsin Chang, Chung- Ping Lai
  • Patent number: 11102891
    Abstract: A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: August 24, 2021
    Assignee: BGT MATERIALS LIMITED
    Inventors: Kuo-Hsin Chang, Jia-Cing Chen, We-Jei Ke, Jingyu Zhang, Chung-Ping Lai
  • Patent number: 10782078
    Abstract: A heat dissipation coating layer contains: a binder and a core-shell heat dissipation filler. The core-shell heat dissipation filler is synthesized in a water bathing process at the temperature within 20° C. to 100° C. The core-shell heat dissipation filler includes a metal core and a shell composed of the mixture of oxide and hydroxide shell. Here the metal core has metal particles, and the shell has a porous structure consisted of a mixture of metal oxide and porous metal hydroxide.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: September 22, 2020
    Assignee: BGT Materials Limited
    Inventors: Chung-Ping Lai, Kuo-Hsin Chang, Jia-Cing Chen, We-Jei Ke
  • Patent number: 10777859
    Abstract: A method and an apparatus for regenerating batteries containing fluid electrolytes are revealed. The method includes the steps of: removing a case of a battery to expose a core of the battery, immersing the core in a functional electrolyte suitable for removing solid electrolyte interface (SEI) layer formed on surface of active materials, measuring characteristic parameters of the functional electrolyte during the period the core is immersed, adjusting concentration and electric conductivity of the functional electrolyte which the core is immersed therein by adding other suitable functional electrolytes according to the measured characteristic parameters until both the concentration and the electric conductivity are within a normal range of batteries or capacity of the core reaches the normal value of the battery. Thus the core is regenerated and re-packaged to form a regenerated battery.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 15, 2020
    Assignee: BGT MATERIALS LIMITED
    Inventors: Hsiao-Hsuan Shen, Kuo-Hsin Chang, Chung-Ping Lai
  • Patent number: 10600946
    Abstract: A method of manufacturing a hexagonal boron nitride (hBN) laminate on a backside of LED filament contains steps of: a) Preparing a substrate of LED filament array; b) Coating the hBN based slurry on the backside of substrate of LED filament and dried at 100-200° C.; c) Cutting the array to single LED filament. A LED filament with hBN based heat dissipation radiation laminate was obtained after this process. For heat dissipation application, hexagonal boron nitride laminate coating can significantly enhance the performance of LED light bulb.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: March 24, 2020
    Assignee: BGT MATERIALS LIMITED
    Inventors: Jingyu Zhang, Kuo-Hsin Chang, Jia-Cing Chen, Chung-Ping Lai
  • Patent number: 10561025
    Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 11, 2020
    Assignee: BGT MATERIALS LIMITED
    Inventors: Kuo-Hsin Chang, Jia-Cing Chen, We-Jei Ke, Jingyu Zhang, Chung-Ping Lai
  • Patent number: 10318857
    Abstract: A printed RFID sensor tag contains: a substrate, a RFID sensor arranged on a top of the substrate, and a protective layer covering the RFID sensor. The RFID sensor includes a RFID sensing antenna and a chip adhered on the RFID sensing antenna. The RFID sensing antenna is partially or totally made of conductive sensing ink/glue printed on the top of the substrate, and the conductive sensing ink/glue consists of conductive ink/glue and multiple sensing materials.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: June 11, 2019
    Assignee: BGT Materials Limited
    Inventors: Chung-Ping Lai, Kuo-Hsin Chang
  • Patent number: 10283683
    Abstract: An LED filament contains: a light transmissive substrate, at least one LED chip, a first electrode pin, a second electrode pin, a light emitting layer, and a phosphor layer. The phosphor layer packages the at least one LED chip, and the first electrode pin and the second electrode pin expose outside the phosphor layer. The light emitting layer is made of electromagnetic wave material of different radiation waves, the at least one LED chip produces excitation light source to excite the phosphor layer to illumine lights, and a part of the excitation light source of the at least one LED chip excites the light emitting layer to illuminate the lights after passing through the substrate. The part of the excitation light source excites phosphors of the light emitting layer to illuminate the lights toward the LED filament or the light emitting layer absorbs visible lights converted from infrared lights.
    Type: Grant
    Filed: October 21, 2018
    Date of Patent: May 7, 2019
    Assignee: BGT Materials Limited
    Inventors: Kuo-Hsin Chang, Chung-Ping Lai
  • Patent number: 10281129
    Abstract: A light-emitting diode light bulb contains: a screw base, a transparent housing, at least one filament support, and at least one LED filament. The transparent housing includes an opening, and the screw base includes a positive terminal and a negative terminal. Each filament support includes two metal posts. Each LED filament includes a substrate, a first electrode pin, a second electrode pin, a thermal radiation film, at least one LED chip, a wire, and a fluorescent. The at least one LED chip is electrically connected with the first and second electrode pins, the first electrode pin is electrically connected with a first metal post, and the second electrode pin is electrically connected with a second metal post. The at least one LED filament and the at least one filament support are accommodated in the transparent housing, the screw base is housed into the opening, and the opening is closed.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: May 7, 2019
    Assignee: BGT Materials Limited
    Inventors: Chung-Ping Lai, Kuo-Hsin Chang
  • Patent number: 10082256
    Abstract: A method of making a LED light bulb with thermal radiation filaments contains steps of: A. providing a substrate which includes multiple conductive portions formed on two ends of the substrate respectively so as to electrically connect with an electronic circuit; B. molding LED chips, wires, and phosphors on a front face of the substrate so as to produce a LED filament sheet; C. forming a thermal radiation dissipation film on a back face of the substrate before or after producing the LED filament sheet; D. cutting the substrate into the thermal radiation filaments, wherein each of the thermal radiation filaments has a part of the thermal radiation dissipation film, a part of the LED filament sheet, and parts of the multiple conductive portions respectively; and E. fixing the thermal radiation filaments into the LED light bulb.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: September 25, 2018
    Assignee: BGT MATERIALS LIMITED
    Inventor: Chung-Ping Lai
  • Publication number: 20170046610
    Abstract: A printed radio frequency sensor structure contains: a substrate, a RF antenna arranged on a top surface of the substrate, and a protection layer covering on the RF antenna arranged, wherein plural sensing materials are directly introduced into a RF antenna mixture of the RF antenna. A method of preparing a RFID sensor tag comprising steps of: A). Printing conductive sensing ink/glue on substrate; B. Drying, curing and compressing the conductive sensing ink/glue to form a conductive antenna mixture with plural sensing materials; C). Bonding a chip on a RFID sensing antenna to form a RFID sensor tag; and D). Coating a protection layer on a top of the RFID sensor tag. Here note protection coating can fully, partially or no cover the conductive sensing antenna.
    Type: Application
    Filed: August 12, 2015
    Publication date: February 16, 2017
    Applicant: BGT Materials Limited
    Inventors: Konstantin NOVOSELOV, Chung Ping LAI, Kuo-Hsin CHANG, Jia-Cing CHEN
  • Patent number: 9563837
    Abstract: A hybrid tag is employed to magnetic system and radio frequency system and contains: an IC chip and an antenna electrically connected with the IC chip. The IC chip includes a memory storage unit configured to store digital data, and the antenna is made of mixture composition in a printing manner, wherein the mixture composition includes electrically conductive material, magnetic material, dispersant and adhesive, and wherein the hybrid tag responds magnetic waves within low frequency (LF) range and responds radio frequency signals within high frequency (HF) range, ultra high frequency (UHF) range, and microwave range. Thereby, the hybrid tag is manufactured easily at low production cost.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: February 7, 2017
    Assignee: BGT MATERIALS LIMITED
    Inventors: Chung-Ping Lai, Jia-Cing Chen, Kuo-Hsin Chang