Abstract: Systems and methods providing for packaging of scalable machines are discussed herein. Some embodiments may include a configurable drawer-based computing system that includes a frame configured to hold drawer modules that may each be slidably inserted into or pulled out from the frame. The system may provide power, networking, and cooling to the drawer modules, even while a drawer module has been pulled out for purposes such as system maintenance. Each drawer module may include printed circuit board assemblies and other components. The system may provide for configurability in the mounting of the drawer modules such that slidable modules that differ in function and/or size may be combined with minimal wasted space within the frame.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: Systems and methods providing for stackable rack-based computing systems are discussed herein. A stackable rack-based computing system may include a plurality of stackable shelf frames. Each stackable shelf frame may include a module and one or more cooling elements to cool the module from a first side. The stackable shelf frames may be adjustable between an open configuration and a stacked configuration. In the stacked configuration, where the stackable shelf frames are stacked on top of each other, the modules may receive cooling from a second side from an adjacent stackable shelf frame. In the open configuration, a gap may be opened between any two of the plurality of stackable shelf frames for service and maintenance tasks.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: Example rack systems that support computing platforms and related hardware are provided. Multiple instances of the example rack system may be combined to create scalable systems. The example racks may incorporate a universal backplane upon which one or more backplane boards may be mounted. Modules of varied functions may be inserted into the backplane boards via a module insertion area. The example racks may include a power bus for powering the backplane boards. The rack system may also include thermal plates, coolant transmission, and cable management solutions to promote heat dissipation. Related apparatuses and methods are also provided.

Abstract: Disclosed is an embodiment of a rack system including a universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane area on a second side of the rack system opposite to the first side, a power bus, a plurality of partitions, a plurality of module bays, and two or more service unit backplanes. The power bus may be configured to provide power to the modules coupled to the universal backplane area.

Abstract: Disclosed is an embodiment of a module for insertion between a first shelf and a second shelf of a rack based processing system. The module includes a first thermal plate substantially parallel to a second thermal plate. An inner surface of the first thermal plate faces an inner surface of the second plate and an outer surface of each of the first and second thermal plates faces opposite to the respective inner surfaces. Each thermal plate is configured to thermally couple to one or more component units locatable between the inner surfaces of the first and second thermal plates.

Abstract: Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, a power bus, a plurality of cooled partitions, a plurality of module bays, two or more service unit backplanes and a coolant source. The power bus may be configured to provide power to the universal backplane mounting area and the plurality of cooled partitions. The rack system may also include a plurality of service units that may be configured to have different functions within the rack system.

Abstract: A cable slack management system may include a frame and a cable management module. The frame may include a plurality of perimeter frame members to provide support for a plurality of component modules. The plurality of component modules may be locatable between a first frame member and a second frame member parallel to the first frame member. The cable management module may be coupled to the first frame member and configured to slide into and out of the first frame member. The cable management module may be configured to hold a portion of one or more cables that run along the first frame member.

Abstract: A mobile container may include a bottom element, a top element, a front element, a back element, and two side elements defining a containment volume. The two side elements may have a length longer than a length of either the front element or the back element. The containment volume may be configured to include a plurality of rack frames. Each rack frame may include a module insertion area on a first side of the rack frame, a universal backplane area, and a power bus. The universal backplane area may be positioned on a second side of the rack frame opposite to the first side and may include at least one mounting surface configured to mount two or more backplane boards. At least two of the backplane boards may be configured to couple to two respective modules that each have at least two different functions and are insertable through the module insertion area. The at least two different functions of at least one backplane board may include rack power and management functions.