Patents Assigned to BMSI, Inc
  • Publication number: 20240051273
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer formed form a composition including polypropylene copolymer and/or a high density polyethylene (HDPE) resin; and a second polymeric layer formed from a composition including a high density polyethylene (HDPE) resin, a linear low density polyethylene (LLDPE) resin, a low density polyethylene (LDPE), and/or LDPE/HDPE copolymer with a coextruded ethyl vinyl alcohol (EVOH) and compatibilizer. Recyclable packaging containers formed of the packaging laminates are also disclosed.
    Type: Application
    Filed: August 18, 2023
    Publication date: February 15, 2024
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Patent number: 11766851
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: September 26, 2023
    Assignee: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20230150249
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 18, 2023
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20220234338
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Application
    Filed: April 11, 2022
    Publication date: July 28, 2022
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20220153001
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer; and a second polymeric layer comprising a high density polyethylene (HDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer.
    Type: Application
    Filed: January 31, 2022
    Publication date: May 19, 2022
    Applicant: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Patent number: 11298922
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 12, 2022
    Assignee: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Patent number: 11235561
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer; and a second polymeric layer comprising a high density polyethylene (HDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: February 1, 2022
    Assignee: BMSI, Inc.
    Inventor: Lee Phillips Gilbert
  • Publication number: 20180354241
    Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene, (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Applicant: BMSI, Inc
    Inventor: Lee Phillips Gilbert