Abstract: A component processing apparatus defines at least one component holding position for holding a component, such as comprising a semiconductor die, a substrate, a cooling plate, a package, an inverter casing, a spacer, etcetera, and comprises at least one displaceable member associated with each component holding position. Each displaceable member is configured and arranged to allow exerting force on a component held in the associated component holding position. The component processing apparatus comprises at least one apparatus part that is susceptible to strain induced by force, in use, exerted by the at least one displaceable member on the respective component(s) held in the component holding position(s), and that has a Fiber Bragg Grating, FBG, strain sensor.
Type:
Application
Filed:
October 16, 2020
Publication date:
March 21, 2024
Applicant:
Boschman Technologies B.V.
Inventors:
Johannes Cornelis de Beijer, Franciscus Gerardus Johannes Boschman
Abstract: A method of closing a mold and a press therefore, whereby a first mold part is moved towards a second mold part by a first relatively large displacement via a mechanical non-fluid drive. The mold parts are then pressed against one another by a fluid system including a pneumatically driven hydraulic system to provide relative high mold pressures. Drive and follower pins are selectively coupled to the hydraulic system by a carousel for selectively coupling a mold part to the hydraulic system during the pressing portion of the cycle. The method and press are particularly suitable for encapsulating electrical components.
Type:
Grant
Filed:
June 4, 1991
Date of Patent:
October 12, 1993
Assignee:
Boschman Technologies B.V.
Inventors:
Josephus J. M. Schraven, Marinus B. J. de Kruijff
Abstract: A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.
Type:
Grant
Filed:
June 4, 1991
Date of Patent:
October 27, 1992
Assignee:
Boschman Technologies B.V.
Inventors:
Josephus J. M. Schraven, Marinus B. J. de Kruijff, Maarten Hoekstra