Patents Assigned to Brewer Science Inc.
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Patent number: 9472436Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: May 8, 2014Date of Patent: October 18, 2016Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9349643Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.Type: GrantFiled: March 28, 2014Date of Patent: May 24, 2016Assignee: Brewer Science Inc.Inventors: Blake Waterworth, Steven Matthew Rich, Molly Hladik, Kirk Emory
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Patent number: 9328246Abstract: Nonpolymeric compounds, compositions, and methods for forming microelectronic structures, and the structures formed therefrom are provided. The nonpolymeric compounds are ring-opened, epoxide-adamantane derivatives that comprise at least two epoxy moieties and at least one adamantyl group, along with at least one chemical modification group, such as a chromophore, bonded to a respective epoxy moiety. Anti-reflective and/or planarization compositions can be formed using these compounds and used in lithographic processes, including fabrication of microelectronic structures.Type: GrantFiled: January 17, 2013Date of Patent: May 3, 2016Assignee: Brewer Science Inc.Inventors: Daniel M. Sullivan, Charlyn Stroud, Jinhua Dai
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Patent number: 9299778Abstract: Manufacturing-friendly and scalable methods for the production of silicon micro- and nanostructures, including silicon nanotubes, are described. The inventive methods utilize conventional integrated circuit and MEMS manufacturing processes, including spin-coating, photolithography, wet and dry silicon etching, and photoassisted electrochemical etch processes. The invention also provides a novel mask, for maximizing the number of tubes obtained per surface area unit of the silicon substrate on which the tubes are built. The resulting tubes have thick and straight outer walls, as well as high aspect ratios.Type: GrantFiled: November 8, 2013Date of Patent: March 29, 2016Assignee: Brewer Science Inc.Inventors: Jyoti K. Malhotra, Jeff Leith, Curtis Planje
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Patent number: 9263314Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: August 4, 2011Date of Patent: February 16, 2016Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9249013Abstract: Compositions for directed self-assembly patterning techniques are provided which avoid the need for separate anti-reflective coatings and brush neutral layers in the process. Methods for directed self-assembly are also provided in which a self-assembling material, such as a directed self-assembly block copolymer, can be applied directly to the silicon hardmask neutral layer and then self-assembled to form the desired pattern. Directed self-assembly patterned structures are also disclosed herein.Type: GrantFiled: April 15, 2013Date of Patent: February 2, 2016Assignee: Brewer Science Inc.Inventors: Yubao Wang, Mary Ann Hockey, Douglas J. Guerrero, Vandana Krishnamurthy, Robert C. Cox
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Patent number: 9224631Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: GrantFiled: February 27, 2014Date of Patent: December 29, 2015Assignee: Brewer Science Inc.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9157003Abstract: New methods for preparing carbon nanotube films having enhanced properties are provided. The method broadly provides reacting carbon nanotubes (CNTs) and compounds comprising a polyaromatic moieties in the presence a strong acid. During the reaction process, the polyaromatic moieties noncovalently bond with the carbon nanotubes. Additionally, the functionalizing moieties are further functionalized by the strong acid. This dual functionalization allows the CNTs to be dispersed at concentrations greater than 0.5 g/L in solution without damaging their desirable electronic and physical properties. The resulting solutions are stable on the shelf for months without observable bundling, and can be incorporated into solutions for printing conductive traces by a variety of means, including inkjet, screen, flexographic, gravure printing, or spin and spray coating.Type: GrantFiled: June 22, 2012Date of Patent: October 13, 2015Assignee: Brewer Science Inc.Inventors: Christopher Landorf, Carissa Jones, Marriana Nelson
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Patent number: 9127126Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.Type: GrantFiled: April 30, 2012Date of Patent: September 8, 2015Assignee: Brewer Science Inc.Inventors: Wenbin Hong, Tony D. Flaim, Rama Puligadda, Susan Bailey
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Patent number: 9123541Abstract: Compositions for directed self-assembly (DSA) patterning techniques are provided. Methods for directed self-assembly are also provided in which a DSA composition comprising a block copolymer is applied to a substrate and then self-assembled to form the desired pattern. The block copolymer includes at least two blocks of differing etch rates, so that one block (e.g., polymethylmethacrylate) is selectively removed during etching. Because the slower etching block (e.g., polystyrene) is modified with an additive to further slow the etch rate of that block, more of the slow etching block remains behind to fully transfer the pattern to underlying layers.Type: GrantFiled: April 1, 2014Date of Patent: September 1, 2015Assignee: Brewer Science Inc.Inventors: Kui Xu, Mary Ann Hockey, Douglas Guerrero
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Patent number: 9117757Abstract: Novel compositions and methods of using those compositions to form high refractive index coatings are provided. The compositions comprise a mixture of two silicone polymers, a catalyst, and an inhibitor for the catalyst. The preferred catalyst comprises platinum. Unlike prior art silicone systems, the inventive composition can be provided in a one-part form due to a substantially improved pot life. The compositions can be spin- or spray-applied, followed by baking to crosslink the polymers and form a cured layer. The inventive cured layers have high refractive indices and light transmissions.Type: GrantFiled: October 16, 2013Date of Patent: August 25, 2015Assignee: Brewer Science Inc.Inventors: Jyoti K. Malhotra, Xing-Fu Zhong
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Patent number: 9110372Abstract: Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the preferred crosslinker is a vinyl ether crosslinker. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light, the cured compositions will decrosslink, rendering them soluble in typical photoresist developing solutions (e.g., alkaline developers).Type: GrantFiled: December 20, 2010Date of Patent: August 18, 2015Assignee: Brewer Science Inc.Inventors: Douglas J. Guerrero, Robert Christian Cox, Marc W. Weimer
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Patent number: 9111981Abstract: New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.Type: GrantFiled: January 23, 2009Date of Patent: August 18, 2015Assignee: Brewer Science Inc.Inventors: Tony D. Flaim, Jeremy McCutcheon
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Patent number: 9102129Abstract: The invention described herein is directed towards spin-on carbon materials comprising polyamic acid compositions and a crosslinker in a solvent system. The materials are useful in trilayer photolithography processes. Films made with the inventive compositions are not soluble in solvents commonly used in lithographic materials, such as, but not limited to PGME, PGMEA, and cyclohexanone. However, the films can be dissolved in developers commonly used in photolithography. In one embodiment, the films can be heated at high temperatures to improve the thermal stability for high temperature processing. Regardless of the embodiment, the material can be applied to a flat/planar or patterned surface. Advantageously, the material exhibits a wiggling resistance during pattern transfer to silicon substrate using fluorocarbon etch.Type: GrantFiled: August 15, 2014Date of Patent: August 11, 2015Assignee: Brewer Science Inc.Inventors: Vandana Krishnamurthy, Daniel M. Sullivan, Yubao Wang, Qin Lin, Sean Simmons
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Patent number: 9099512Abstract: New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.Type: GrantFiled: November 22, 2010Date of Patent: August 4, 2015Assignee: Brewer Science Inc.Inventors: Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20150122426Abstract: Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.Type: ApplicationFiled: November 21, 2014Publication date: May 7, 2015Applicant: BREWER SCIENCE INC.Inventors: Rama Puligadda, Xing-Fu Zhong, Tony D. Flaim, Jeremy McCutcheon
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Publication number: 20150064385Abstract: A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.Type: ApplicationFiled: August 28, 2014Publication date: March 5, 2015Applicant: Brewer Science Inc.Inventors: Tony D. Flaim, Jeremy McCutcheon
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Patent number: 8968989Abstract: The present invention provides novel methods of fabricating microelectronics structures, and the resulting structures formed thereby, using EUV lithographic processes. The method involves utilizing an assist layer immediately below the photoresist layer. The assist layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred assist layers are formed from spin-coatable, polymeric compositions. The inventive method allows reduced critical dimensions to be achieved with improved dose-to-size ratios, while improving adhesion and reducing or eliminating pattern collapse issues.Type: GrantFiled: November 20, 2012Date of Patent: March 3, 2015Assignee: Brewer Science Inc.Inventors: Tantiboro Ouattara, Carlton Washburn, Vandana Krishnamurthy, Douglas Guerrero, Aline Collin
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Patent number: 8940104Abstract: A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.Type: GrantFiled: August 2, 2011Date of Patent: January 27, 2015Assignee: Brewer Science Inc.Inventors: Xing-Fu Zhong, John Moore
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Publication number: 20140362493Abstract: New polymeric dielectric materials are provided for high power capacitors, especially for mobile and weapons applications. These materials utilize aminoplast crosslinking in their polymeric structure. The aminoplast crosslinking ability of these materials allows them to be customized for a number of applications, but also allows the materials to have a higher crosslinking density, leading to higher dielectric constants, higher breakdown voltage, and higher thermal stability. These materials can be incorporated into current capacitor manufacturing schemes with little to no processing changes.Type: ApplicationFiled: May 30, 2014Publication date: December 11, 2014Applicant: Brewer Science Inc.Inventor: Marc Weimer