Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be)+(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: The process for producing net shape or near net shape metal parts is improved by sintering a compact in a reducing atmosphere where the compact contains a metal and chemically-bound oxygen in the form of a metal oxide, for example, and the chemically-bound oxygen is in an amount sufficient to improve the sintering of the compact. Improved sintering is facilitated when the metal oxide forms a metal/metal oxide eutectic during reduction of the chemically-bound oxygen in a reducing atmosphere during the sintering process. The compact can contain a metal oxide and a solution compound to produce an alloy part, provided the chemically-bound oxygen is present in an amount sufficient to improve sintering. In a preferred embodiment, the compact also contains a reinforcement compound and is sintered to make a metal matrix composite. The resultant density of the near net shape metal parts made by the improved sintering process is preferably about 97% or more of the theoretical density.

Abstract: The present invention relates to a higher order beryllium-nickel alloy containing copper represented by the formula (0.4-1.50% Be)+(0<Cu.ltoreq.15%)+(0<Ti.ltoreq.0.6%)+(0<C.ltoreq.1.0%)+(0<Mg.ltoreq.0. 25%), the balance Ni, and an article constructed, at least in part, of the same. Such alloys are characterized by improved machinability with optimum combination of heat treatment response, hardness, magnetic behavior, ductility, strength and cost.

Abstract: A process for bonding a first metal such as beryllium to a second metal such as a copper alloy using a powder metallurgy compositional gradient. According to one aspect of the present invention, a sequence of powder layers is located between beryllium and copper alloy pieces, the layers containing mixtures of a beryllium powder and a copper powder, e.g., of a copper alloy, high purity copper and/or the like. The composition of the layers is adjusted such that the layer adjacent the beryllium piece is beryllium rich, and so that the layers become progressively richer in copper as they get closer to the copper piece. The variation in composition between the pieces produces the compositional gradient. Bonding of the beryllium and copper alloy pieces is then accomplished by a hot consolidation technique such as hot isostatic pressing, vacuum hot pressing, solid state bonding or diffusion bonding at a temperature generally within a range of 500.degree. and 800.degree. C.

Abstract: Articles of manufacture are made of aluminum-beryllium alloys having substantially randomly distributed aluminum-rich and beryllium rich phases to provide substantially isotropic mechanical properties, such as high stiffness and low co-efficients of thermal expansion, whereby the articles of manufacture provide more rapid and accurate responses.

Abstract: The sinterability of a copper/tungsten green compact is improved by using copper oxide, tungsten oxide or both as the copper and/or tungsten source. Sinterability is further enhanced by including steam in the sintering atmosphere. Spontaneous combustion of the source powders used to form the sintering compacts can be reduced or eliminated by including corrosion inhibitor in the powders.

Abstract: A multi-layer metal composite for microwave tubing and the like, which comprises a tubular shaped copper alloy base metal (e.g., brass or phosphorus bronze) lined with silver. A relatively thin interliner layer of a grain refiner containing copper alloy (e.g., copper-zirconium alloy (C15100), tellurium-copper (C14530), cadmium-copper (C14300), manganese-copper (C15500), alumina-copper (C157XX), beryllium-copper (C17410), or the like) is provided between the base metal and the silver, for limiting diffusion of impurities from the base metal into the silver coating and for maintaining a smooth, relatively constant cross section of silver.

Abstract: A heat exchanger assembly, having a first oxygen-rich copper base layer joined to a first layer of beryllium oxide, a first oxygen-rich copper layer joined to the first beryllium oxide layer, a second beryllium oxide layer joined to the first oxygen-rich copper layer, a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer, a second oxygen-rich copper base layer joined to the second beryllium oxide layer, and a heat exchanger structure direct bonded to the second base layer. The structure has a plurality of oxygen-rich copper fins stacked upon one another, each fin having a channel at a selected location therein. The material to material interfaces between adjacent stacked fins are joined to one another by direct bonding so as to form a solidified block structure. Each of the channels form a cooling chamber for receiving a fluid flow.

Abstract: A metal system which comprises a titanium base metal strip, at least one surface having platinum stripes thereon. As a multilayer laminate, there is provided a titanium base metal strip sandwiched between first and second copper layers. At least one surface of the first copper layer facing the titanium has platinum stripes. A method of producing the metal system and laminate, includes the step of initially cleaning bonding surfaces of a first copper strip. During a first processing phase, platinum stripes are cold roll bonded to at least one of the first copper strip surfaces. Excess material is skived from the striped copper strip, then the strip is cleaned. Upon a second process phase, bonding surfaces of the striped first copper layer, a second copper strip layer and a titanium base metal strip are cleaned. Next, the striped first copper layer is placed on the titanium base metal strip, the platinum stripes facing the titanium, and the titanium base metal strip is placed upon the second copper layer.

Abstract: A package for a backside-ground high power transistor comprises a metal base, a flat insulator layer on the base defining a window for receiving the transistor and a pair of flat metal layer bonded to the upper surface of the insulator layer, the flat metal layers serving as electrical leads for connection to the collector and drain of the transistor received therein. A method for bonding a ceramic to a metal is also provided by the present invention. The method comprises the steps of contacting eutectic-forming layers on a common shim structure with ceramics and metals, heating the eutectic-forming layers to a temperature that is greater than the melting temperature of the eutectic-forming layers, and allowing the eutectic-forming layers to solidify, thereby bonding the ceramic to the metal.

Abstract: Disclosed is a practical aluminum based alloy containing 1 to 99 weight percent beryllium, and improved methods of semi-solid processing of aluminum alloys containing beryllium. The present methods avoid molten beryllium, agitation of molten aluminum-beryllium alloys and the need for introducing shear forces by utilizing atomized or ground particles of beryllium mixed with solid, particulate or liquidus aluminum.

Abstract: The sinterability of a copper/tungsten green compact is improved by using copper oxide, tungsten oxide or both as the copper and/or tungsten source. Sinterability is further enhanced by including steam in the sintering atmosphere.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: Disclosed is a practical magnesium based alloy containing 1 to 99 weight % beryllium and an improved method of semi-solid processing of magnesium alloys containing beryllium. The present method avoids agitation of molten alloys and the need for introducing shear forces by utilizing atomized or ground particles of beryllium mixed with solid, particulate or liquidus magnesium.

Abstract: Disclosed is a practical aluminum-based alloy containing 1 to 99 weight percent beryllium and improved methods for the investment casting of net shape aluminum-beryllium alloy parts.

Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900.degree. to 1500.degree. F., (ii) warm worked at greater than about 30% strain at a strain rate greater than or equal to about (2.210.times.10.sup.7)/exp[(2.873.times.10.sup.4)/(T+459.4.degree.)], where T is in .degree. F., at the temperature, (iii) annealed at a temperature between 1375.degree. and 1500.degree. F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480.degree. and 660.degree. F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.

Abstract: Disclosed is a practical aluminum-based alloy containing 1 to 99 weight percent beryllium and improved methods for the investment casting of net shape aluminum-beryllium alloy parts.

Abstract: A controlled oxygen content copper clad laminate product. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: Articles of manufacture are made of aluminum-beryllium alloys having substantially randomly distributed aluminum-rich and beryllium rich phases to provide substantially isotropic mechanical properties, such as high stiffness and low coefficients of thermal expansion, whereby the articles of manufacture provide more rapid and accurate responses.