Abstract: A crystal growing device includes a furnace, a platform, a crucible, a heating unit, a heat transmitting block, and a heat exchanger. The furnace defines a chamber therein. The platform is disposed in the chamber and has a top surface and a bottom surface. The crucible is disposed on the top surface of the platform for receiving a crystal seed layer and a raw material therein. The heating unit is disposed in the chamber and surrounds the crucible. The heat transmitting block is disposed at the bottom surface of the platform and is made of a material with high thermal conductivity. The heat exchanger is coupled to the heat transmitting block for absorbing heat from the heat transmitting block.

Abstract: A heating system includes first and second heating devices, a temperature sensor, a first controller and a second controller. The first and second heating devices are respectively arranged above a crucible and around the crucible for heating semiconductor material in the crucible. The temperature sensor is configured to detect the temperature of the first heating device and to generate a temperature signal. The first controller is configured to control operation of the first heating device so as to adjust the temperature thereof based on the temperature signal. The second controller is coupled to the second heating device and is configured to control operation of the second heating device so as to adjust the temperature thereof, based on an external control signal.

Abstract: An apparatus for laminating a film on a wafer includes a cutting mechanism and a laminating mechanism. The cutting mechanism has a cutting device disposed thereon for pre-cutting a dry film. The cutting mechanism has a supporter disposed adjacent to the cutting device for positioning a wafer. The cutting mechanism has a suction member disposed and corresponding to the cutting device for sucking the cut dry film to allow the cutting device pre-cutting the dry film and moving the cut dry film to the supporter. The laminating mechanism has a first lower member provided for positioning the wafer and a first upper member disposed above the first lower member for laminating the cut dry film with electrically heating to adhere the cut dry film on the wafer.

Abstract: A transporter for dry film laminator includes a base, a film guider mounted in the base, and a film leveler mounted on the base. The base has a platform disposed thereon. The base has two film extending rollers respectively disposed on two ends thereof. The base has two guiding rails disposed on two sides thereof. The film leveler has two ends respectively mounted on the two guiding rails. The film guider is provided for transporting the dry film to the platform.

Abstract: A method for laminating a film on a wafer includes a pre-cutting step: pre-cutting a dry film for fitting a size wafer size; a pre-attaching step: moving and pre-attaching the cut dry film on the wafer for corresponding the cut dry film and the wafer; a laminating step: laminating the cut dry film on the wafer with heating for fixing the cut dry film on the wafer. A flattening step: vertically and rigidly laminating the cut dry film on the wafer with heating again for flattening the cut dry film on the wafer.

Abstract: A protection mechanism for dry film laminator includes a lower member, and an upper member located above the lower member. The upper member moves downwardly/upwardly relative to the lower member. The upper member has a plurality of through holes defined therein and extending therethrough. An air supply device communicates with the through holes for feeding air into the through holes. A film guide device is disposed above the upper member and includes a supply spool and a take-up spool disposed thereon. A continuous release film movably connected to the film guide device. The continuous release film which is wound on the supply spool is routed from the supply spool to flatly pass between the upper member and the lower member, and is sequentially collected by the take-up spool.

Abstract: A flattening mechanism for dry film laminator includes a lower member connected to a dry film laminator. The lower member has a base portion formed thereon. The base portion has a plurality of air holes defined therein. The lower member has a lifting holder movably disposed thereon for holding a wafer. The wafer has a dry film disposed thereon. An upper member is movably disposed above the lower member. The upper member has a pressing portion disposed on a bottom thereof. The pressing portion has a steel plate disposed thereon and a first electric heating layer mounted on a top of the steel. A release film is movably guided between the upper member and the lower member, such that the wafer is lifted to press against the steel plate via the release film for enhancing a lamination of the dry film to the wafer and flattening the dry film.

Abstract: A transporter for dry film laminator includes a base, a film guider mounted in the base, and a film leveler mounted on the base. The base has a platform disposed thereon. The base has two film extending rollers respectively disposed on two ends thereof. The base has two guiding rails disposed on two sides thereof. The film leveler has two ends respectively mounted on the two guiding rails. The film guider is provided for transporting the dry film to the platform.

Abstract: A cutting mechanism for dry film laminator includes a main base connected to a dry film laminator. The main base has a cutting space defined therein. The main base has two rollers disposed thereon and located beside the cutting space. The two rollers flatly guide a film above the cutting space. A film-carrying device is movably disposed on the main base. The film-carrying device includes a suction member movably disposed thereon. The suction member has at least one annular groove defined therein and corresponding to a shape of a wafer. A cutting device is movably disposed below the main base. The cutting device includes a film cutter movably disposed thereon. The cutting device includes an elevating device disposed thereon for moving the film cutter upward/downward. The cutting device includes a motor disposed thereon for rotating the film cutter.