Abstract: An object of the present invention is to provide an electroless plating bath having excellent property in plating film deposition without containing halides such as chloride in the electroless plating bath.

Abstract: A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the workpiece; and a clamping member biasing member configured to bias at least one of the first clamping member and the second clamping member in a direction of bringing the first contact portion and the second contact portion closer to each other. The first contact portion has a plurality of plate spring portions extending from the first base portion, the plurality of plate spring portions configured to elastically deform independently from each other to come into contact with the workpiece.

Abstract: A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a body 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the body 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the body 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the body 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature.

Abstract: The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 ?m or less.

Abstract: To provide surface treatment that can reduce occurrence of defects caused by incorporation of dust. Rollers 40 are rotatably fixed to rotating shafts 72 provided to protrude from lateral protective walls 49. The lateral protective walls 49 are fixed perpendicularly to lower protective walls 47 fixed to outer walls 39. Hanging plates 64 of a hanger 50 extend through a space 43 between both lower protective walls 47 and support clips 52. A liquid 41, such as water, is filled in spaces defined by the lateral protective walls 49, the lower protective walls 47, and the outer walls 39. The liquid 41 is filled to cover about half of each rotating shaft 72. Thus, fine dust generated by a transferring mechanism is captured by the liquid 41 and prevented from drifting from the space 34 toward the substrate 54.

Abstract: A drying apparatus of the present invention includes a drying tank for performing drying processing of a workpiece, a fixture for the workpiece, heating means opposed to a front surface of the workpiece, and heating means opposed to a back surface of the workpiece, wherein each heating means is inclined from a horizontal line in its longitudinal direction.

Abstract: A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

Abstract: A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.

Abstract: A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid comprises: a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC2H4)n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC3H6)y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).

Abstract: The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

Abstract: The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.

Abstract: The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

Abstract: A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the workpiece; and a clamping member biasing member configured to bias at least one of the first clamping member and the second clamping member in a direction of bringing the first contact portion and the second contact portion closer to each other. The first contact portion has a plurality of plate spring portions extending from the first base portion, the plurality of plate spring portions configured to elastically deform independently from each other to come into contact with the workpiece.

Abstract: A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the workpiece; and a clamping member biasing member configured to bias at least one of the first clamping member and the second clamping member in a direction of bringing the first contact portion and the second contact portion closer to each other. The first contact portion has a plurality of plate spring portions extending from the first base portion, the plurality of plate spring portions configured to elastically deform independently from each other to come into contact with the workpiece.

Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

Abstract: To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank 2a includes an upper guide rail 11 that is provided above the plating tank 2a and transports a transport hanger 15a in a moving direction and a lower guide rail 14 that is provided inside the plating tank 2a and generates an attractive force against a lower clamp 49 of the transport hanger 15a. In the plating tank 2a, an attractive force is generated while performing plate processing to pull the lower clamp 49 of the transport hanger 15a downward, thereby giving tension to a plate-like work W.

Abstract: Disclosed herein is an aluminum oxide film remover for removing an oxide film on the surface of aluminum or aluminum alloy, which comprises silver ions and/or copper ions, a solubilizing agent for silver ions and/or copper ions, and a quaternary ammonium hydroxide compound, and has a pH value of 10 to 13.5. A method for surface treatment of aluminum or aluminum alloy is also disclosed, which comprises immersing a workpiece having aluminum or aluminum alloy at least on the surface thereof in the aluminum oxide film remover, and depositing the silver and/or copper contained in the remover on the surface of aluminum or aluminum alloy while removing the aluminum oxide film.

Abstract: A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.

Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

Abstract: A metal member for magnetic storage medium includes an aluminum alloy substrate, and a nonmagnetic layer formed on at least one surface of the aluminum alloy substrate, and the nonmagnetic layer comprises a Ni—Cu—P based alloy containing 5 mass % to 50 mass % Cu and 100 ppm to 1000 ppm Pb.