Patents Assigned to Cabot Mircroelectronics Corporation
  • CMP composition with a polymer additive for polishing noble metals
    Patent number: 7563383
    Abstract: The invention provides a method of polishing a substrate comprising contacting a substrate comprising a noble metal on a surface of the substrate with a chemical-mechanical polishing system comprising (a) a polishing component selected from the group consisting of an abrasive, a polishing pad, and a combination thereof, (b) an oxidizing agent, (c) an ethylene-oxide containing polymer, and (d) a liquid carrier, and abrading at least a portion of the noble metal with the chemical-mechanical polishing system to polish the substrate.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: July 21, 2009
    Assignee: Cabot Mircroelectronics Corporation
    Inventors: Francesco de Rege Thesauro, Benjamin P. Bayer