Abstract: In one aspect of the invention, a semiconductor packaging apparatus is provided and comprises: a bonding device for bonding a component to a substrate; a motor for driving the bonding device to operate according to a predetermined motion trajectory; a position sensor for detecting a position of the bonding device at a specific time point and generating a position signal; a motion control unit comprising a path planner for generating a position-time command for the bonding device according to a bonding process requirement, the motion control unit being configured to enable the path planner to update the position-time command based on a touch information between the component and the substrate. In a further aspect of the invention, a control algorithm for the semiconductor packaging apparatus to identify and generate the touch information is also provided, and the process control flow is optimized using the touch information.

Abstract: Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.

Abstract: A component packaging apparatus includes: at least one component supply device; at least one component processing device, which is configured to process components provided by the component supply device; at least one component transfer device, each component transfer device respectively having multiple bond heads, each bond head transferring one of the said components which are processed by the component processing device; wherein the component processing device comprises a pick-up platform, which is configured to simultaneously arrange the multiple components, and the multiple bond heads are configured to pick up the multiple components simultaneously from the pick-up platform at one time. A method for packaging components is also provided.