Abstract: A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.

Abstract: An device for programming and reading codes onto an array of binary data storage element includes: a shift register for receiving, sequentially, a binary data series to be written onto the data storage elements; and control logic circuit for determining whether or not data is to be applied to each of the data storage elements in turn, by reading sequentially the data stored in the shift register and if it is determined that data is to be stored on a respective data element, applying a write signal to that data element. The control logic circuit applies a permanent locking signal to the array of data storage elements such that further writing to the elements is prohibited when it has been determined that data has been written to each of the elements which require data to be written thereto.

Abstract: A memory element for a flash memory including a first element made from electrically conductive material and having a stable position, an electrically conductive floating gate for storing charge, and means for urging the element from the stable position towards a position enabling a transfer of charge to the floating gate.

Abstract: A micro-mechanical element includes a discrete switching element and a switching means for applying force to the switching element to move the switching element between two stable positions.

Abstract: A method of manufacturing an integrated circuit device from a plurality of physically separate individual electrical elements comprises manufacturing each of the plurality of elements and verifying the operability of each of the elements. Inoperable elements are discarded and he operable elements retained in a fluid. The retained elements are aligned so that each element is adjacent to at least one other element and the arrangement of elements treated to provide connections therebetween and thereby to produce a single integrated circuit device.

Abstract: A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.