Abstract: Provided is a flat panel type heat transfer device for effectively dissipating heat generated from a heat source in contact with a casing, comprising the casing sealed and having a certain shape, a coolant loaded in the casing and undergoing phase transition, one or more flat panel type hydrophilic wick structures in contact with at least a portion of an inner surface of the casing, manufactured by aggregating fibers capable of absorbing the coolant, and providing a coolant passage leading the coolant to flow in a direction parallel to the inner surface of the casing, and one or more support structures, each having a plurality of through holes which provide coolant passages through which coolant in a vapor phase or a liquid phase flows, while supporting the hydrophilic wick structure such that the hydrophilic wick structure is in close contact with the inner surface of the casing, wherein the coolant fills a portion of a space in the casing and circulates in the space in a manner such that the coolant flows t

Abstract: The present invention relates to a flat type heat transferring device, and manufacturing method of the same, which is comprises of a capillary wick that is provided inside a case and formed by weaving a wire in the horizontal direction and the vertical direction so as to absorb a liquid coolant, and a linear member that is formed to have a different wire diameter from the wire of the capillary wick and woven in the capillary wick to form a space where a vapor coolant flows. Accordingly, the mechanically stabilized support rigidity can be secured and an ultra thin configuration can be implemented with a light-weight, in particular, the problem of degrading the capillary force is resolved, and it has the effect that the cooling efficiency can be improved with smooth flowing of a coolant.