Abstract: A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A heat sink of a metallic shielding structure is provided in this disclosure, which includes a heating module and a cooling module. The heating module includes a heat generating component, a substrate, and a shield housing. The heat generating component is electrically connected to one side surface of the substrate and forms an opening corresponding the substrate. The cooling module includes a body and a working fluid is disposed in the body.

Abstract: A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.

Abstract: A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.

Abstract: In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is attached onto an external side of the memory and includes an insert portion, and the heat dissipating body includes a base plate, a plurality of heat dissipating fins extended from the base plate, and a pawl arm extended from the base plate and in an opposite direction of the fins, and the heat dissipating body is coupled to the insert portion in a replaceable manner by the pawl arm, and the clamping element is provided for clamping the base plate and the isothermal vapor chamber plate, such that the heat dissipating body can be replaced on the isothermal vapor chamber plate easily.

Abstract: A tower type heat dissipating structure is applied to dissipate the heat of a solar power system. The solar power system is provided with a reflector having a hemispheric surface for reflecting the sunlight to a solar cell. The heat dissipating structure comprises a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is connected with the solar cell, and the other side is provided with a groove for being embedded an end of the plate type heat pipe. The heat dissipating fins is arranged with an inclination angle against the plate type heat pipe that can promote the heated air within the gaps to rise. The heat is rapidly conduced to prevent the solar cell from being destroyed by overheating for reducing the repairing costs.

Abstract: A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.

Abstract: A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

Abstract: A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element.