Patents Assigned to CERAMTEC-PLATZ GmbH
  • CERAMIC PRINTED CIRCUIT BOARD COMPRISING AN AL COOLING BODY
    Publication number: 20140016330
    Abstract: The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.
    Type: Application
    Filed: March 30, 2012
    Publication date: January 16, 2014
    Applicant: CERAMTEC-PLATZ GmbH
    Inventors: Alexander Dohn, Alfred Thimm