Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.
Type:
Grant
Filed:
August 30, 1991
Date of Patent:
November 10, 1992
Assignees:
Soken Chemical & Engineering Co., Ltd., Chemitech Corporation