Abstract: A method of preparing a cured coating or molded article prepared from a composition comprising an actinic-radiation curing polymer, wherein the composition is cured with actinic radiation at a temperature of at most 150° C. to form the cured coating or molded article; wherein the cured coating or molded article has a thickness of at least about 0.

Abstract: A cured coating or molded article prepared from a composition comprising an actinic-radiation curing polymer, wherein the composition is cured with actinic radiation at a temperature of at most 150° C. to form the cured coating or molded article; wherein the cured coating or molded article has a thickness of at least about 0.5 mm and a hardness of about Shore A 90 to about Shore D 90.

Abstract: Intaglio printing methods and apparatuses are disclosed, involving the use of a curable resin composition (e.g., curable by actinic radiation). The composition may be applied to a substrate, such as a printable material, at a depth of 250 ?m or more, in order to create a desirable, three-dimensional effect. To produce this type of printed or coated substrate, the composition is first transferred to cells or recesses, having a depth of these dimensions, onto a printing surface (e.g., a gravure cylinder) and then at least partially cured. The at least partially cured composition is then transferred to the substrate (e.g., paper or plastic) where additional curing may occur, to produce the final printed or coated article.

Abstract: Molded articles and methods of producing them are provided. In certain examples, the molded article may include a substrate and a resin molded onto the substrate. In other examples, the molded article may further include indicia on or in a surface of the resin molded onto the substrate. Processes of producing the molded articles are also disclosed.

Abstract: A cured coating or molded article prepared from a composition comprising an actinic-radiation curing polymer, wherein the composition is cured with actinic radiation at a temperature of at most 150° C. to form the cured coating or molded article; wherein the cured coating or molded article has a thickness of at least about 0.

Abstract: A one component, moisture-cure, colorless or colored, protective or decorative high-build lensing or doming resin system is described. Use of these polymer systems have the advantage of eliminating the mixing, handling, and high toxicity associated with standard two-component epoxy or polyurethane lensing resins, or one-component ultraviolet cured systems.

Abstract: A splice protection system including a water resistant material disposed on a flexible wrapper that retains the water resistant material is disclosed. The splice protection system is useful for preventing unwanted entry of external elements into the splice regions of signal transmission devices, thus preserving the integrity and function of the signal transmission devices.

Abstract: A splice protection system including a water resistant material disposed on a flexible wrapper that retains the water resistant material is disclosed. The splice protection system is useful for preventing unwanted entry of external elements into the splice regions of signal transmission devices, thus preserving the integrity and function of the signal transmission devices.

Abstract: Non-conductive, flexible, substrates having a conductive coating which are useful for EMI/RFI shielding applications. The conductive coating is compatible with the nonconductive substrate and provides continuous conductivity and complete EMI/RFI shielding.

Abstract: An electrically conductive flexible polyurethane foam including a polyurethane and at least one conductive filler dispersed therein in an amount effective to provide EMI/RFI shielding, wherein the polyurethane comprises an isocyanate component to active hydrogen component in a ratio of at most about 0.20:1. Preferably, the foam has compression deflection value at 50% compression of at most about 25 psi, a foam density of at most 0.95 g/cm3 and/or noise shielding effectiveness at a frequency of about 20 to about 1000 MHz of at least about 10 dB.