Patents Assigned to Cheng Mei Instrument Technology Co., Ltd.
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Patent number: 9810640Abstract: A panel inspection apparatus is provided. The panel inspection apparatus has a support platform, a delivery platform and a panel inspection assembly. The delivery platform is disposed on the support platform, and the delivery platform has a push module for delivering the panel. The panel inspection assembly includes a plurality of light source modules and a plurality of image-taking modules corresponding to the light source modules. The light source modules include a front light source, a first horizontal light source, and a back light source. The image-taking modules include a front light image-taking module, a first horizontal light image-taking module, and a back light image-taking module. The push module delivers the panel across the support platform so that a plurality of light beams emitted from the light source modules can scan the panel to finish the panel inspection process.Type: GrantFiled: January 26, 2016Date of Patent: November 7, 2017Assignee: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.Inventors: Chao-Yi Yeh, Pin-Chuan Su, Shang-Iun Yang, Chih Yuan Liu
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Patent number: 9785285Abstract: A detection method for a touch panel is provided. The method includes the following steps: (a) using a transfer device to move the touch panel; (b) placing the touch panel on an LCD monitor; (c) emitting at least one striped light pattern from the LCD monitor; (d) using at least one camera to capture an image that is formed by the at least one striped light pattern through the touch panel; and (e) using a processor to analyze the image to complete the detection of the touch panel.Type: GrantFiled: January 14, 2016Date of Patent: October 10, 2017Assignee: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.Inventors: Chao-Yi Yeh, Hung Chun Lo, Shang-Iun Yang, Chi-Yuan Lin
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Patent number: 8311666Abstract: A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.Type: GrantFiled: December 28, 2009Date of Patent: November 13, 2012Assignee: Cheng Mei Instrument Technology Co., Ltd.Inventors: Te Chun Chen, Chien Chao Huang, Cheng Tao Tsai
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Patent number: 8275188Abstract: A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor.Type: GrantFiled: December 23, 2008Date of Patent: September 25, 2012Assignee: Cheng Mei Instrument Technology Co., Ltd.Inventor: Cheng Tao Tsai
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Patent number: 8226346Abstract: A tray handling apparatus comprises a plurality of guides, a chuck device, a linear movement device, and a rack and pinion device. A space defined by the erected guides is used to hold a tray stack. The chuck of the chuck device is located at the center position of the bottom area of the space. The linear movement device is used to move the chuck relative to the guides. The rack and pinion device is used to cause the guides to move symmetrically. When an operator moves any one of the guides, the other guides move symmetrically and the center of the bottom area of the space surrounded by the guides remains at the same location during the movement of the guides. The operator does not need to adjust the position of the chuck if the positions of the guides are changed.Type: GrantFiled: February 24, 2009Date of Patent: July 24, 2012Assignee: Cheng Mei Instrument Technology Co., Ltd.Inventor: Cheng Tao Tsai
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Patent number: 7878336Abstract: A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.Type: GrantFiled: September 8, 2009Date of Patent: February 1, 2011Assignee: Cheng Mei Instrument Technology Co., Ltd.Inventors: Cheng Tao Tsai, Chao Sheng Yu
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Publication number: 20100166535Abstract: A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.Type: ApplicationFiled: December 28, 2009Publication date: July 1, 2010Applicant: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.Inventors: TE CHUN CHEN, CHIEN CHAO HUANG, CHENG TAO TSAI
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Publication number: 20100063619Abstract: A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.Type: ApplicationFiled: September 8, 2009Publication date: March 11, 2010Applicant: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.Inventors: CHENG TAO TSAI, CHAO SHENG YU
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Publication number: 20090214326Abstract: A tray handling apparatus comprises a plurality of guides, a chuck device, a linear movement device, and a rack and pinion device. A space defined by the erected guides is used to hold a tray stack. The chuck of the chuck device is located at the center position of the bottom area of the space. The linear movement device is used to move the chuck relative to the guides. The rack and pinion device is used to cause the guides to move symmetrically. When an operator moves any one of the guides, the other guides move symmetrically and the center of the bottom area of the space surrounded by the guides remains at the same location during the movement of the guides. The operator does not need to adjust the position of the chuck if the positions of the guides are changed.Type: ApplicationFiled: February 24, 2009Publication date: August 27, 2009Applicant: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.Inventor: CHENG TAO TSAI
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Publication number: 20090169094Abstract: A system for inspecting chips in a tray comprises a three-dimensional sensor, a focus computing unit, an image sensor and a focusing device. The three-dimensional sensor is used to obtain the height signals of surfaces of the chips. The focus computing unit calculates the focusing positions of chips. The surface inspection sensor is used to inspect the surfaces of the chips. The focusing device is used to bring the images of the surfaces of the chips into the focus of the image sensor.Type: ApplicationFiled: December 23, 2008Publication date: July 2, 2009Applicant: CHENG MEI INSTRUMENT TECHNOLOGY CO., LTD.Inventor: CHENG TAO TSAI