Abstract: Disclosed herein is an apparatus and method for drying solid articles such as semiconductor wafers. In one embodiment, the dryer comprises a process tank and a drying fluid supply system. The process tank includes a plurality spray nozzles to spray a non-flammable drying fluid to wet surfaces of the article for drying without the necessity of heat or other external means. The drying fluid comprises a non-flammable, environmentally compatible, and a non-hazardous fluid including a drying agent of (hydrofluoroether) HFE and a surfactant of isopropyl alcohol (IPA). Even without the benefit of heating, little if any solution or static charge remains after drying. The drying apparatus includes a drying fluid supply system for providing the drying fluid to the plurality of spray nozzles.