Abstract: For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.

Abstract: For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.

Abstract: For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.

Abstract: For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.

Abstract: A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.