Abstract: A flexible thermal energy dissipating and LED mounting arrangement includes a plurality of LEDs and a flexible thermally conductive sheet. The thermally conductive sheet defines a plurality of openings therethrough each sized to receive and securely hold therein a different one of the plurality of LEDs with the flexible thermally conductive sheet about the opening in physical, thermally conductive contact with the at least one side portion of the encapsulating material. The flexible thermally conductive sheet absorbs thermal energy generated within each of the plurality of LEDs as a result of current flow through the LED circuit and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive sheet. The flexible thermally conductive sheet is formable to direct radiation from the plurality of LEDs in multiple directions while securely holding each of the plurality of LEDs within a corresponding one of each of the plurality of openings.

Abstract: A thermal energy dissipating arrangement includes a semiconductor device and a thermally conductive medium. The semiconductor device includes a semiconductor circuit defining a semiconductor junction and encapsulating material in physical contact with and surrounding the semiconductor circuit. The thermally conductive medium defines an opening sized to receive the semiconductor device such that the thermally conductive medium defining the opening is in physical, thermally conductive contact with an exterior surface of the encapsulating material about the semiconductor device with the thermally conductive medium defining the opening intersecting an angle of less than or equal to a predefined angle relative to a plane defined by the semiconductor junction about a periphery of the semiconductor circuit.

Abstract: An arrangement for dissipating thermal energy generated by an LED includes an LED and a thermal energy dissipating medium. The LED includes an LED circuit, encapsulating material surrounding the LED circuit, and first and second electrical leads extending into the encapsulating material and electrically connected to the LED circuit. The thermal energy dissipating medium defines an opening therethrough sized to receive therein the LED such that the thermal energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of at least one side portion of the encapsulating material of the LED. The thermal energy dissipating medium is not electrically connected to any of the LED circuit, the mounting surface, the first electrical lead and the second electrical lead. The thermal energy dissipating medium is formed of a material having a thermal conductivity of greater than or equal to 50 W/mK.