Abstract: A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an ?s! matrix close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.

Abstract: Processes for preparing same for demateably interconnecting arrays of contact pads. The connector has a preformed sheet-form member provided with a series of apertures through each of which an electrically conductive plated metal deposit extends. An integral end of the deposits protrudes outwardly beyond a surface of the sheet-form member, forming contact surfaces for demateably engaging the pads.

Abstract: A multilayer printed wiring board is presented for surface mounting or through hole technology, which includes one or more layers of a high capacitance flexible dielectric sheet material. The dielectric sheet is comprised of a monolayer of multilayer or single layer high dielectric constant (e.g. ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric (e.g. ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces. The board of the present invention alleviates the need for decoupling capacitors, thus resulting in significant, space savings on the board surface.

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.