Abstract: A molded circuit board has an aperture wherein a contact member is flexibly carried by a living hinge. Conductor traces are plated upon the contact member, the living hinge, and the circuit board. The conductor traces form contacts on the contact member which are electrically connected to the conductor traces on the circuit board. A mating connector, having resilient contacts, is inserted into the aperture, folding back the contact member. The resilient contacts engage the contacts on the contact member. Another embodiment includes dual contact members hinged on opposing sides of an aperture. A further embodiment has a contact member which is folded up and inserted into a mating connector. In the above embodiments the contact members are molded with thin breakable portions of material holding the contact members in planes of the circuit boards. The present invention is formed from a polymeric material including one of polypropylene, polyethylene, and nylon.