Abstract: An optical subassembly for non-reciprocal coupling of light from a planar optical waveguide output outside the optical subassembly to an optical fiber includes a carrier configured to support the optical subassembly, an optical fiber fixed to the optical subassembly, a focusing optical system consisting two foci with one focus coincident with the input of optical fiber, an optical isolator to transmit light unidirectionally between two foci, an input boundary provided by the carrier to align the optical subassembly with the planar optical waveguide output. In particular, the optical subassembly is operably configured to provide a low transmission loss for light traveling from the planar optical waveguide output to the optical fiber.

Abstract: A light receiving and emitting module includes a sub-mount platform, a photoelectrical conversion component, a lens and a base. The sub-mount platform is made of silicon-based material and has first and second contact surfaces. The photoelectrical conversion component is disposed on the first contact surface. The lens is disposed on the second contact surface. The sub-mount platform is disposed on one side of the base. The first contact surface and second contact surface have therebetween a height difference, such that the photoelectrical conversion component matches the center of the lens. Further provided is a light receiving and emitting device including the light receiving and emitting module, a printed circuit board and a plurality of conducting wires. The conducting wires are electrically connected to the photoelectrical conversion component and printed circuit board. The conducting wires are disposed on at least two sides of the light receiving and emitting module.

Abstract: The application provides an optical fiber splice with an adjustable sleeve, which comprises: a carrier, an optical fiber cable and an adjustable sleeve. The carrier has a first fixed end and a second fixed end along an optical fiber extension direction. The optical fiber cable has a cable part and an optical fiber outlet part. The optical fiber outlet part extends from the cable part and is fixed to the first fixed end. The adjustable sleeve is sleeved on the cable part. An outer peripheral surface of the adjustable sleeve is provided with a plurality of positioning features. Wherein in the optical fiber extension direction, the positions of the positioning features disposed on the adjustable sleeve are deviated from each other by a distance. One of the positioning features is fixed to the second fixed end.

Abstract: A PCB bridge for interconnection of two or more semiconductor chips for data communication between the semiconductor chips includes a plurality of metal strips; and a dielectric material disposed in between the plurality of metal strips. The PCB bridge is employed in a vertical direction in a semiconductor module for interconnection of two or more semiconductor chips, the vertical direction of the PCB bridge provides a flexible impedance matching by adjusting the dielectric material and a trace width of the PCB bridge, and the vertical direction of the PCB bridge avoids signal reflections by matching the impedance to a source, and a trace length of the PCB bridge is limited by spacing in between two semiconductor chips which further limited inductance of the trace of the PCB bridge.

Abstract: An optical subassembly structure for mode conversion by an active alignment of an optical fiber with a semiconductor optical waveguide includes a sub-mount for holding the optical subassembly structure, a semiconductor die mounting on the sub-mount, the semiconductor optical waveguide growing on the semiconductor die and a glass capillary subassembly actively aligned to the semiconductor optical waveguide.

Abstract: An optical interposer for providing optimal optical coupling between an optical transceiver interface and an external optical interface includes an interposer photonic integrated circuit (PIC) operably configured to couple an optical signal between the optical transceiver interface and the external optical interface, one or more waveguide based optical devices operably integrated on a common substrate and one or more of interposer input/output (I/O) channels operably configured with the optical transceiver interface and the external optical interface.

Abstract: A transmitter optical sub-assembly (TOSA) structure having an independent upward heat dissipation path for dissipating heat in an upward direction including an independent signal source, an LDU assembly including a laser diode emitting a plurality of optical signals, a cascade LDU holding the laser diode, a lens positioned in front of the laser diode on the cascade LDU and an optical bench assembly including an optical bench assembled on a photonic integrated circuit having a plurality of passive optical components assembled on the optical bench. In particular, the independent signal source, the laser diode and the cascade LDU, are independent from the plurality of passive optical components on the photonic integrated circuit.

Abstract: An optical mode converter for coupling between photonic integrated circuit (PIC) and optical fiber of different mode sizes is illustrated. The optical mode converter includes a waveguide assembly including a Single waveguide structure, a Multi-layer waveguide structure, and a Transitional waveguide structure. The Single waveguide structure includes a single waveguide. The dimension and propagation constant of a first end, of the single waveguide, is similar to a waveguide of a photonic integrated circuit (PIC). Furthermore, the Multi-layer waveguide structure included a multi-layer waveguide. Further, the Transitional waveguide structure is formed at a transitional structure. The Transitional waveguide structure allows transition of an optical mode between the Single waveguide structure and Multi-layer waveguide structure.

Abstract: A method and a system for active alignment of a light source assembly along three dimensions in an optical bench plane are provided. The light source assembly, preferably a laser diode on its sub-mount, is actively aligned in three dimensions, longitudinal, transection and vertical along the optical bench. The light source assembly is attached on edge of the optical bench, via adhesion processes, such as solder welding. Optical components such as collimator lens, isolator, etc are first passively aligned on the optical bench using alignment marks and epoxy slots provided on the surface of the optical bench. Then, laser diode, mounted on a laser diode sub-mount, is aligned in X and Z direction. Thereafter, the light source assembly is pushed towards the edge of the optical bench and attached with the edge via a solder joint. Also, a compensator can be actively aligned until the optimum light intensity achieved.

Abstract: The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.

Abstract: A silicon photonics package includes an L-shaped block formed from a cuboid having a through-hole through front and rear faces thereof. The L-shaped block includes two horizontal inner surfaces lying in a plane longitudinally bisecting a section of the through-hole, a bisected through-hole formed between the two horizontal inner surfaces, and a vertical inner surface. A lens block with a lens or lens array is bonded on the rear face of the L-shaped block. A vertical metal pad is attached on the front face of the L-shaped block. The vertical metal pad is soldered together with two horizontal metal pads on a photonic integrated circuit block formed with a waveguide or waveguide array such that the center of the optical lens is optically aligned with the waveguide. A method for fabricating the silicon photonics package, and an active alignment method for light coupling are also disclosed.

Abstract: An optical module package has a first case, a second case and a fiber unit. The first case has a case bottom-part formed along the length direction of the fiber unit, a bottom convex-part formed on the case bottom-part so as to project toward inside direction of the first case and an elastic support part made of elastic member and covering the bottom convex-part. The optical waveguide device is supported by the elastic support part and the optical fiber is arranged at the distant position from the elastic support part.