Patents Assigned to Coilcraft, Incorporated
  • Patent number: 12094633
    Abstract: An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.
    Type: Grant
    Filed: January 8, 2024
    Date of Patent: September 17, 2024
    Assignee: Coilcraft, Incorporated
    Inventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
  • Patent number: 11869696
    Abstract: An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: January 9, 2024
    Assignee: Coilcraft, Incorporated
    Inventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
  • Patent number: 10319507
    Abstract: An electronic component includes a wire winding wound around a central axis. The wire winding having first and second ends, and first and second terminals are connected to or formed by the first and second ends. The terminals provide electrical contacts for connecting the component into a circuit. The component has a wet press molded body made of a mixture of magnetic and non-magnetic material that is heated and pressed about the wire winding. The wet press molded body leaves at least a portion of the terminals exposed for mounting the component to the circuit.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: June 11, 2019
    Assignee: Coilcraft, Incorporated
    Inventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
  • Patent number: 10098231
    Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: October 9, 2018
    Assignee: Coilcraft, Incorporated
    Inventor: Stephen Michael Sedio
  • Patent number: 9554470
    Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: January 24, 2017
    Assignee: Coilcraft, Incorporated
    Inventor: Stephen Michael Sedio
  • Patent number: 9318251
    Abstract: A method of manufacturing an electronic component including providing a wire having first and second ends and a pre-formed core, winding the wire about at least a portion of the pre-formed core and connecting the first and second wire ends to at least one terminal for mounting the component to a circuit, and using a wet press process to form a mixture of magnetic and/or non-magnetic material over at least a portion of the wire and pre-formed core, and harden the mixture without exposing the wire and pre-formed core to the damaging forces of a dry press process to form an electronic component with a generally planar top surface with which the component can be picked and placed on a circuit using conventional pick-and-place equipment.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: April 19, 2016
    Assignee: Coilcraft, Incorporated
    Inventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
  • Patent number: 8945948
    Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: February 3, 2015
    Assignee: Coilcraft, Incorporated
    Inventor: Stephen Michael Sedio
  • Patent number: 8156634
    Abstract: A method of assembling an electronic component in accordance with the invention comprises providing an electronic component having a body and a core and applying a film over at least a portion of the body and core so that the film secures the body and core to one another.
    Type: Grant
    Filed: May 25, 2005
    Date of Patent: April 17, 2012
    Assignee: Coilcraft, Incorporated
    Inventors: David A. Gallup, Lawrence B. LeStarge
  • Publication number: 20110005064
    Abstract: An electronic component including a core having a wire wound around a portion of the core with first and second ends being connected to terminals for mounting the component to corresponding lands in a circuit. The component having an outer body made of a mixture of magnetic and/or non-magnetic material and a binder which can either be potted and cured or compression molded. The mixture encasing at least a portion of the core and wire and leaving at least a portion of the terminals exposed for mounting the component to the circuit using conventional pick-and-place equipment. Further, methods of manufacturing such components and customizing same are disclosed.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 13, 2011
    Applicant: Coilcraft, Incorporated
    Inventors: Andrzej Klesyk, Scott D. Hess, Lawrence B. Lestarge
  • Publication number: 20100128434
    Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
    Type: Application
    Filed: January 28, 2010
    Publication date: May 27, 2010
    Applicant: Coilcraft, Incorporated
    Inventor: Stephen Michael Sedio
  • Patent number: 7690105
    Abstract: A method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: April 6, 2010
    Assignee: Coilcraft, Incorporated
    Inventor: Stephen Michael Sedio
  • Patent number: 7639109
    Abstract: An electronic component in accordance with the invention includes a body, such as a base, having a high magnetic permeability material applied to an external surface thereof and a wire winding wound about at least a portion of the high magnetic permeability material. In a preferred form, the body is made of a non-conducting material, such as ceramic or plastic, and the high magnetic permeability material is made of a magnetic material such as ferrite or a metallic glass alloy (i.e., an amorphous metal). The component further includes a spacer for separating the wire winding from the high magnetic permeability material in order to prevent the amorphous metal from damaging the wire winding. The resulting electronic component is capable of sensing magnetic fields and may be used in a variety of circuits such as compasses and magnetometers.
    Type: Grant
    Filed: January 24, 2008
    Date of Patent: December 29, 2009
    Assignee: Coilcraft, Incorporated
    Inventors: Gregory L. Proehl, Craig Verdung, Steven W. Hickman
  • Publication number: 20080169894
    Abstract: An electronic component in accordance with the invention includes a body, such as a base, having a high magnetic permeability material applied to an external surface thereof and a wire winding wound about at least a portion of the high magnetic permeability material. In a preferred form, the body is made of a non-conducting material, such as ceramic or plastic, and the high magnetic permeability material is made of a magnetic material such as ferrite or a metallic glass alloy (i.e., an amorphous metal). The component further includes a spacer for separating the wire winding from the high magnetic permeability material in order to prevent the amorphous metal from damaging the wire winding. The resulting electronic component is capable of sensing magnetic fields and may be used in a variety of circuits such as compasses and magnetometers.
    Type: Application
    Filed: January 24, 2008
    Publication date: July 17, 2008
    Applicant: COILCRAFT, INCORPORATED
    Inventors: Gregory L. Proehl, Craig Verdung, Steven W. Hickman
  • Patent number: 6914506
    Abstract: An inductive component in accordance with the invention includes a core which is connected to a base via a film having an adhesive coating on at least one side. In a preferred form, the core is made of a magnetic material such as ferrite and the base has a plurality of metalized pads attached thereto for electrically and mechanically connecting the component to a printed circuit board (PCB). The component further includes a winding of wire wound about at least a portion of the core, with the ends of the wire winding being electrically and mechanically connected to the metalized pads.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: July 5, 2005
    Assignee: Coilcraft, Incorporated
    Inventors: David A. Gallup, Lawrence B. LeStarge
  • Patent number: 6717500
    Abstract: A low profile electronic component in accordance with the invention includes an elongated core made from a magnetic material such as ferrite, which is connected to a base having a plurality of metalized pads attached thereto for electrically and mechanically connecting the component to a printed circuit board. Support structures or spacers are positioned at the ends of the core and are provided to assist the core in shielding the component and concentrating its magnetic lines of flux. The component also includes a winding of wire wound about at least a portion of the base and core assembly between the supports, and has the ends of the wire electrically and mechanically connected to the metalized pads of the base. A top portion may be coupled to the core via the supports to cover at least a portion of the windings of wire of the component. The supports separate the core and the top portion and maintain the top portion at a desired position with respect to the winding and the core.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: April 6, 2004
    Assignee: Coilcraft, Incorporated
    Inventors: Catalin Constantin Girbachi, Nelson Garcia, Richard D. Rehak, Chris Caramela, Scott Hess
  • Patent number: 6690255
    Abstract: A low profile surface mountable component having a strengthened structure in accordance with the disclosure set forth herein comprises an elongated core having first and second ends and first and second supports for supporting the core and for absorbing forces experienced by the component that are attributable to mechanical shock. Each of the supports defines a receptacle for receiving one of the core's first and second ends. The component further comprises means between the ends of the core and the supports for permitting movement of the core with respect to the supports, and has metalized pads provided on the supports for electrically connecting and mounting the support to the printed circuit board. At least one wire is wound about a portion of the core and has its ends electrically connected to the metalized pads of the supports.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: February 10, 2004
    Assignee: Coilcraft, Incorporated
    Inventors: Christopher Leonard Caramela, Catalin Constantin Girbaci, Gregory Proehl
  • Publication number: 20020164892
    Abstract: A low profile electronic component in accordance with the invention includes an elongated core made from a magnetic material such as ferrite, which is connected to a base having a plurality of metalized pads attached thereto for electrically and mechanically connecting the component to a printed circuit board. Support structures or spacers are positioned at the ends of the core and are provided to assist the core in shielding the component and concentrating its magnetic lines of flux. The component also includes a winding of wire wound about at least a portion of the base and core assembly between the supports, and has the ends of the wire electrically and mechanically connected to the metalized pads of the base. A top portion may be coupled to the core via the supports to cover at least a portion of the windings of wire of the component. The supports separate the core and the top portion and maintain the top portion at a desired position with respect to the winding and the core.
    Type: Application
    Filed: April 24, 2002
    Publication date: November 7, 2002
    Applicant: Coilcraft, Incorporated
    Inventors: Catalin Constantin Girbachi, Nelson Garcia, Richard D. Rehak, Chris Caramela, Scott Hess
  • Patent number: RE39453
    Abstract: A low profile inductive component in accordance with the disclosure set forth here comprises a low profile body having spread apart soldering pads for electrically and mechanically attaching the structure to a printed circuit board and defining an aperture between the pads. A magnetic core is disposed in the aperture. A wire is wound around the core having a first and second end connected to the pads. One end of the core is disposed in the aperture of the low profile body and its other end, which is larger than the aperture, is spaced from the body by spacers extending from the body.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: January 2, 2007
    Assignee: Coilcraft, Incorporated
    Inventors: James G. Boytor, Catalin C. Girbaci, Helen O. Gogny
  • Patent number: D1036384
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: July 23, 2024
    Assignee: Coilcraft, Incorporated
    Inventors: Andrew Klesyk, Lawrence B. Lestarge, Scott Hess, Hyeonchul Park
  • Patent number: D1036385
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: July 23, 2024
    Assignee: Coilcraft, Incorporated
    Inventors: Andrew Klesyk, Lawrence B. Lestarge, Scott Hess, Matt Goedken