Patents Assigned to Col Tech Co., Ltd
  • Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer
    Patent number: 8043898
    Abstract: A method of manufacturing a semiconductor package is provided, which can improve the quality of plating through reduction of plating deviation, and improve molding and soldering efficiencies in forming a molding compound and packaging the semiconductor package onto a printed circuit board.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: October 25, 2011
    Assignee: Col Tech Co., Ltd
    Inventors: Ji-Yong Lee, Kwang-Wook Choi