Abstract: This method comprises the following steps: the obtaining (210; 210*) of relative layout parameters, each between two objects of a set of objects; the association (211; 211*), with each relative layout parameter received, of a value, called reliability of the relative layout parameter. It moreover comprises the following loop of steps (212; 212*), executed at least once: the selection (214; 214*) of a working sub-set, as a function of the reliabilities of the relative layout parameters; the determination (230; 230*) of new relative layout parameters, each between an object belonging to the working sub-set and an object external to the working sub-set; the association (232; 232*), with each new determined relative layout parameter, of a reliability calculated from the reliabilities of the relative layout parameters of the objects of the working sub-set.

Abstract: This device for quantization of an analogue signal, called the input signal, includes an electronic circuit, called the sign analysis circuit (110), designed to supply a first bit of the output signal, called the sign signal (Bs) which takes a first value when the input signal (Ve) is positive and a second value when the input signal (Ve) is negative. It includes in addition an electronic circuit, called the envelope analysis circuit (112), designed to supply a second bit of the output signal called the envelope variation bit (Bvar env), which takes a first value, called high value, when an envelope signal (Venv) of the input signal is increasing, and a second value, called low value, when the envelope signal (Venv) is decreasing.

Abstract: A method for metalizing at least one blind via formed in at least one substrate, including at least the following steps: a) arranging at least one solid portion of electrically conductive material in the blind via, b) performing a thermal treatment of the solid portion of electrically conductive material, making it melt in the blind via, c) cooling the electrically conductive material, solidifying it in the blind via, and wherein, before carrying out step a), at least part of the walls of the blind via is covered with a material able to prevent wetting of said part of the walls of the blind via by the melted electrically conductive material obtained during the performance of step b), the solidified electrically conductive material obtained after carrying out step c) being able not to be secured to said non-wetting part of the walls of the blind via.

Abstract: The invention concerns a method to allocate transmission resources in a cell network of cooperative type. Each cell comprises a source, a receiver and optionally a half-duplex relay to relay data transmitted by the source to the receiver. The invention draws advantage from the half-duplex mode of a relay belonging to a cell, by allocating to the source of a neighbouring cell a resource used by this relay during one same transmission timeslot.