Abstract: The invention relates to a method for making a handle wafer (20?) for microelectronic functional wafers, including at least one transparent window (22, 24) for viewing through the thickness of the handle wafer, this method including: a) the making of at least one cavity (21, 23) in said handle wafer, b) the formation of at least one viewing window in said cavity on an alignment or receiving surface.
Type:
Application
Filed:
June 30, 2010
Publication date:
January 13, 2011
Applicant:
Comm. á I'éner. atom. et aux énergies alter.