Abstract: A test probe assembly includes a probe-supporting component and a test probe on it. According to one aspect of the invention, the probe-supporting component takes the form of a probe-supporting housing in which the test probe is partially disposed so that two test probe legs extend out of the housing to spaced-apart distal end portions of the legs, with the housing enhancing leg stability and limiting leg contact for less stray-impedance influence on test results when a user holds the housing and squeezes the distal end portions toward terminals on a device under test (DUT).

Abstract: A test probe assembly includes a probe-supporting component and a test probe on it. According to one aspect of the invention, the probe-supporting component takes the form of a probe-supporting housing in which the test probe is partially disposed so that two test probe legs extend out of the housing to spaced-apart distal end portions of the legs, with the housing enhancing leg stability and limiting leg contact for less stray-impedance influence on test results when a user holds the housing and squeezes the distal end portions toward terminals on a device under test (DUT).

Abstract: A multi point contactor (MPC) on a component testing system for electrically contacting a terminal on a device under test (DUT) includes at least three independently moveable contacts to help insure at least two of them contact the DUT terminal. At least one of the contacts includes an integral spring, preferably in the form of a blade laser machined from a sheet of electrically conductive material to include a first portion for bearing against the contact-holding structure, a second portion for bearing against the terminal on the DUT, and a third portion interconnecting the first and second portions that functions as an integral spring bias for spring biasing the second portion from the first portion toward the terminal on the DUT. Preferably, the third portion of the blade has a serpentine shape that consistently results in desired constant-force spring characteristics over a nominal range of blade travel.

Abstract: A collapsible apparatus (10) recovers and dispenses packaging material. The collapsible apparatus (10) includes a receptacle (20) that is permeable to air. A disc (30) defines a lower end of the receptacle (20). A collection tube (36) is slideably received in a hole (34) of the disc (30) and has an inlet (38) outside the receptacle (20) and an outlet (40) inside the receptacle (20). A fan (60) is mounted to the disc (30) and communicated with the collection tube (36) to form a vacuum in the collection tube (36). The vacuum pulls the packaging material through the collection tube (36) and deposits the packaging material in the receptacle (20). A discharge valve (81) is a scissors valve that extends through the disc (30) for discharging packaging material from the receptacle (20).

Abstract: A contactor assembly useable on a component testing system for electrically contacting a terminal on a device under test (DUT) for parametric testing and eventual sorting as part of component batch processing includes a holder subassembly and a tip subassembly. The holder subassembly includes a housing and spring-biasing components within the housing. The housing has a proximal end portion for mounting on the component testing system and a distal end portion for holding the tip subassembly proximate the terminal of the device under test. The tip subassembly includes a blade-holding structure and at least one blade held by the blade-holding structure, and the contactor assembly includes components (i.e., a quick-release mechanism) for removably mounting the tip subassembly on the distal end portion of the housing with the spring-biasing components spring biasing the blade toward the terminal of the device under test.

Abstract: A vacuum ring on a component testing system includes a metallic base material defining a vacuum-communicating passageway. A ceramic layer on the base material, preferably 20-100 micrometers thick and formed by a micro-arc oxidation process resulting in molecular adhesion, improves abrasion resistance and makes the vacuum ring more arc-over proof. A test plate for holding DUTs includes such a ceramic layer that provides better wear while enabling use of the base as a guard layer during testing. Another aspect of the invention concerns a vacuum ring having an eject hole pattern for discharging compressed gas toward DUTs in order to eject DUTs from a test plate. The eject hole pattern includes a plurality of closely spaced apart holes, each measuring less than the size that would be large enough to receive a DUT having the predetermined minimum cross sectional area.

Abstract: A vacuum ring on a component testing system includes a metallic base material defining a vacuum-communicating passageway. A ceramic layer on the base material, preferably 20-100 micrometers thick and formed by a micro-arc oxidation process resulting in molecular adhesion, improves abrasion resistance and makes the vacuum ring more arc-over proof. A test plate for holding DUTs includes such a ceramic layer that provides better wear while enabling use of the base as a guard layer during testing. Another aspect of the invention concerns a vacuum ring having an eject hole pattern for discharging compressed gas toward DUTs in order to eject DUTs from a test plate. The eject hole pattern includes a plurality of closely spaced apart holes, each measuring less than the size that would be large enough to receive a DUT having the predetermined minimum cross sectional area.

Abstract: A multi point contactor (MPC) on a component testing system for electrically contacting a terminal on a device under test (DUT) includes at least three independently moveable contacts to help insure at least two of them contact the DUT terminal. At least one of the contacts includes an integral spring, preferably in the form of a blade laser machined from a sheet of electrically conductive material to include a first portion for bearing against the contact-holding structure, a second portion for bearing against the terminal on the DUT, and a third portion interconnecting the first and second portions that functions as an integral spring bias for spring biasing the second portion from the first portion toward the terminal on the DUT. Preferably, the third portion of the blade has a serpentine shape that consistently results in desired constant-force spring characteristics over a nominal range of blade travel.

Abstract: A contactor assembly useable on a component testing system for electrically contacting a terminal on a device under test (DUT) for parametric testing and eventual sorting as part of component batch processing. At least three contacts are provided to help insure at least two of them contact the DUT terminal, each of the contacts having a forward edge for physically and electrically contacting the DUT terminal. A contact-holding structure mountable on the component testing system supports the contacts in side-by-side relationship for independent movement of the first, second, and third forward edges toward and away from the DUT terminal.

Abstract: A test plate for holding miniature electronic circuit components on a component testing system as a part of batch processing for parametric testing purposes, including passive, two-terminal, ceramic capacitors, resistors, multilayer inductors, inductor beads, varistors, thermistors, fuses, sensors, actuators, and the like, or another type of device under test (DUT), includes a DUT-holding plate having an upper side, a lower side, and a rotational axis. The DUT-holding plate defines a plurality of DUT-engaging holes extending through the DUT-holding plate from the upper side to the lower along central axes of the DUT-engaging holes that are not parallel to the rotational axis. With the DUT-holding plate oriented so that the rotational axis is not vertical, the DUT-engaging holes change orientation relative to vertical as they orbit the rotational axis. According to a separate aspect, the DUT-holding plate includes upper and lower layers that are bonded together to form the DUT-holding plate.

Abstract: A test plate for holding miniature electronic circuit components as a part of batch processing for parametric testing purposes, including passive, two-terminal, ceramic capacitors, resistors, multilayer inductors, inductor beads, varistors, thermistors, fuses, sensors, actuators, and the like, or another type of device under test (DUT), includes a multilayer DUT-holding plate having a rotational axis and at least two layers centered on the rotational axis. A conductive layer of the two layers includes oversize holes in alignment with DUT-engaging holes in a nonconductive layer of the two layers that enable use of the first conductive layer as a guard layer held at a guard potential for electrical testing purposes in order to eliminate or at least significantly reduce the effects of stray impedances on test results. Additional conductive guard layers and nonconductive layers may be included.

Abstract: A contactor assembly useable on a component testing system for electrically contacting a terminal on a device under test (DUT) for parametric testing and eventual sorting as part of component batch processing includes a holder subassembly and a tip subassembly. The holder subassembly includes a housing and spring-biasing components within the housing. The housing has a proximal end portion for mounting on the component testing system and a distal end portion for holding the tip subassembly proximate the terminal of the device under test. The tip subassembly includes a blade-holding structure and at least one blade held by the blade-holding structure, and the contactor assembly includes components (i.e., a quick-release mechanism) for removably mounting the tip subassembly on the distal end portion of the housing with the spring-biasing components spring biasing the blade toward the terminal of the device under test.

Abstract: A test plate for holding miniature electronic circuit components as a part of batch processing for parametric testing purposes, including passive, two-terminal, ceramic capacitors, resistors, multilayer inductors, inductor beads, varistors, thermistors, fuses, sensors, actuators, and the like, or another type of device under test (DUT), includes a multilayer DUT-holding plate having a rotational axis and at least two layers centered on the rotational axis. A conductive layer of the two layers includes oversize holes in alignment with DUT-engaging holes in a nonconductive layer of the two layers that enable use of the first conductive layer as a guard layer held at a guard potential for electrical testing purposes in order to eliminate or at least significantly reduce the effects of stray impedances on test results. Additional conductive guard layers and nonconductive layers may be included.

Abstract: A contactor assembly useable on a component testing system for electrically contacting a terminal on a device under test (DUT) for parametric testing and eventual sorting as part of component batch processing. At least three contacts are provided to help insure at least two of them contact the DUT terminal, each of the contacts having a forward edge for physically and electrically contacting the DUT terminal. A contact-holding structure mountable on the component testing system supports the contacts in side-by-side relationship for independent movement of the first, second, and third forward edges toward and away from the DUT terminal.

Abstract: A method and apparatus is provided for sorting semiconductor devices for processing where the semiconductor devices have been singulated from a strip containing a plurality of semiconductor devices and where an electronic strip map has been created corresponding to the strip of semiconductor devices and the electronic strip map contains address and quality information related to each individual singulated semiconductor device. The method includes the steps of moving a pickup device to a location adjacent the singulated semiconductor devices and selectively picking up a first plurality of singulated semiconductor devices based on the electronic strip map information related to the singulated semiconductor devices and moving the semiconductor devices that have been picked up to a predetermined location based on the electronic strip map information related to the specific semiconductor devices that have been picked up and unloading the first plurality of semiconductor devices at the predetermined location.

Abstract: The present invention is directed to an apparatus and method for efficiently and accurately sorting spherical objects based on their diameters. The apparatus of the present invention comprises a support frame, an inclined measurement chute having a measurement channel through which a laser beam can be transmitted, a feeder for feeding spherical objects into the measurement chute, a laser micrometer, a plurality of receptacles for receiving the sorted objects, a sorter for directing the objects into one of the plurality of receptacles, and a computer for directing the sorter to place the objects into the appropriate receptacles.

Abstract: A method and apparatus is provided for sorting semiconductor devices for processing where the semiconductor devices have been singulated from a strip containing a plurality of semiconductor devices and where an electronic strip map has been created corresponding to the strip of semiconductor devices and the electronic strip map contains address and quality information related to each individual singulated semiconductor device. The method includes the steps of moving a pickup device to a location adjacent the singulated semiconductor devices and selectively picking up a first plurality of singulated semiconductor devices based on the electronic strip map information related to the singulated semiconductor devices and moving the semiconductor devices that have been picked up to a predetermined location based on the electronic strip map information related to the specific semiconductor devices that have been picked up and unloading the first plurality of semiconductor devices at the predetermined location.

Abstract: A monolithic glove box door having a panel and a release assembly mount integral with the panel. The release assembly mount is adapted to couple a glove box latching mechanism to the panel for movement relative thereto as well as including an aperture adapted to receive a glove box handle for movement relative to the panel.

Abstract: A mini-floppy disk or like information storage device is comprised of a circle of data storage medium having a central metal hub. In use, the hub is contacted with and driven by a magnetized spindle. The hub comprises a ferromagnetic substrate and a metal coating. The coating has magnetization B.sub.s which is less than the magnetization of the substrate. The coating is harder than the substrate, preferably greater than 400 DPH hardness number. The coating is deposited with an amorphous microstructure while the substrate is crystalline. The coating has a nodular surface texture and surface oxide film which provides improved adhesive bond strength, where the medium is joined to the hub. The coating preferably is an electroless plating deposit, comprised of nickel or cobalt base metal, with phosphorous or boron additive; most preferably it is nickel-11% phosphorous.

Abstract: An apparatus for thermally conditioning a semiconductor unit is provided which includes a surface plate for receiving the semiconductor unit thereon which is connected to a thermoelectric device and a closed loop heat exchanger. At least one temperature sensor is disposed adjacent the surface plate for sensing the temperature of the surface plate. The thermoelectric device has first and second sides with the first side disposed against the surface plate. The closed loop heat exchanger is coupled to the second side of the thermoelectric device. The closed loop heat exchanger includes a chamber or cavity having an inlet and an outlet with the chamber disposed adjacent the second side of the thermoelectric device. The closed loop heat exchanger further includes conduit connected to the inlet and outlet of the chamber and a heat transfer unit connected to the conduit opposite the chamber.