Abstract: A memory cooling device includes two symmetrically formed cooling foils, which sandwich a memory therebetween. The inner surfaces of the two cooling foils touch the two sides of the memory. Further, at least a folded portion formed on the cooling foils includes a buckling element and a buckling hole formed thereon. Therefore, the memory cooling device is structurally simple and easy to assemble, which can largely simplify the fabrication process thereof.

Abstract: A memory heat-dissipating device embodying two heat-conducting films, two heatsinks and two clip members, wherein the two heatsinks mutually clip together, and which thereby forms a space between inner side surfaces of the heatsinks that proffers a memory to be disposed and contained therein. Furthermore, the heat-conducting films are separately attached and so configured to an inner side surface of each of two heatsinks. Inverted U-shaped clip brace portions, center of which are open-mouthed, are configured as protrusions on each outer side surface of fins of each of the heatsinks respectively, in addition, an inwardly press-folded anti-dust strip is configured between clip support mounts configured on top edges of two sides of the heatsinks, and which are utilized to prevent dust and impurities from penetrating the heatsinks, thereby influence on effectiveness of the memory and the heatsinks is avoided.