Abstract: Certain exemplary embodiments can provide structures used to form printed board layer-to-layer interconnects using solder. When the structures are laminated together, forming a printed board, the solders fuse or bond to other electrically conductive materials forming layer-to-layer interconnects. Benefits include reduced fabrication time and costs, fewer and simpler process steps, known metallurgy, increased reliability, and a significant reduction in environmental impact.

Abstract: An apparatus for rapid thermal testing of samples consisting of a single sample chamber in which the samples are preferably arranged circularly around the opening through which a fluid of varying temperature, preferably air, is introduced to provide for rapid, uniform cooling and heating of the samples. The samples are preferably uniformly spaced to allow for uniform air flow. The samples are mounted in slots which are preferably oriented radially outward from the opening. The sample mounts comprise electrical connectors which form a network connected to at least one ohmmeter for measuring the resistance of the samples. The samples preferably comprise test coupons, each with multiple daisy-chained nets of vias or other components to be tested. Also a method for thermal testing of samples consisting of steps to characterize the samples before the test is run.

Abstract: An apparatus for rapid thermal testing of samples consisting of a single sample chamber in which the samples are preferably arranged circularly around the opening through which a fluid of varying temperature, preferably air, is introduced to provide for rapid, uniform cooling and heating of the samples. The samples are preferably uniformly spaced to allow for uniform air flow. The samples are mounted in slots which are preferably oriented radially outward from the opening. The sample mounts comprise electrical connectors which form a network connected to at least one ohmmeter for measuring the resistance of the samples. The samples preferably comprise test coupons, each with multiple daisy-chained nets of vias or other components to be tested. Also a method for thermal testing of samples consisting of steps to characterize the samples before the test is run.