Patents Assigned to Cool Options, Inc.
  • Patent number: 6685855
    Abstract: A method of making a thermally-conductive casing for an optical head in a disc player is provided. The method involves molding a polymer composition comprising: i) about 20% to about 80% by weight of a polymer matrix such as polyphenylene sulfide, and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite into a casing for the optical head. A reinforcing material, such as glass, and other additives, such as flame retardants, can be incorporated into the polymer composition.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: February 3, 2004
    Assignee: Cool Options, Inc.
    Inventors: James Miller, Kevin McCullough, E. Mikhail Sagal
  • Patent number: 6681487
    Abstract: The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: January 27, 2004
    Assignee: Cool Options, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Patent number: 6680015
    Abstract: A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer composition that is filled with thermally conductive filler material. The molded heat sink is freely convecting through the part which makes it more efficient and has an optimal thermal configuration.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: January 20, 2004
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6620366
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6620497
    Abstract: A thermally conductive and electrically insulative polymer composition and a method for creating the same is provided. Thermally conductive filler material is coated with a thermally conductive and electrically insulative coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electrically insulative coating material prevents the transfer of electricity through the filler material thus resulting in an electrically insulative composition.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: September 16, 2003
    Assignee: Cool Options, Inc.
    Inventors: Lyle James Smith, E. Mikhail Sagal, James D. Miller, Kevin McCullough
  • Patent number: 6611660
    Abstract: An electric heater element, that is injection overmolded with a thermally conductive polymer having a thermal conductivity of at least 3 W/m° K, includes surface enhancements to increase the overall outer surface area of the element that is in contact with a fluid to be heated, thereby enhancing the efficiency of heat transfer into the fluid. The heater element has a solid core having a resistance heating element spirally wound about its outer surface. An outer covering is injection overmolded onto the core sealing the heating element and shielding it from the exterior environment. While the outer covering seals the heating element it also includes surface enhancements such as concentric fins, pins or discs that increase the contact surface area of the outer cover, further enhancing the heat transfer properties of the heating element.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: August 26, 2003
    Assignee: Cool Options, Inc. a New Hampshire corp.
    Inventor: E. Mikhail Sagal
  • Patent number: 6587330
    Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: July 1, 2003
    Assignee: Cool Options, Inc.
    Inventor: E. Mikhail Sagal
  • Patent number: 6585039
    Abstract: The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: July 1, 2003
    Assignee: Cool Options, Inc.
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Patent number: 6557859
    Abstract: A net-shape molded elastomeric gasket for dissipating heat and providing electro-magnetic interference (EMI) shielding for an electronic device is formed by loading a base elastomeric matrix material with thermally conductive filler and EMI reflective metallic filler and injecting the mixture into a mold cavity. The gasket of the present invention provides superior sealing between the case sections of an electronic device by shielding the device from EMI infiltration along the seam between the sections. In addition, the gasket of the present invention is in thermal communication with the case sections of the electronic device to provide thermal transfer and dissipation between the separate parts of the device.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: May 6, 2003
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, James D. Miller, Mikhail Sagal
  • Patent number: 6543524
    Abstract: A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: April 8, 2003
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, E. Mikhail Sagal, James D. Miller
  • Patent number: 6540948
    Abstract: A method of overmolding a heat pipe includes providing an injection mold apparatus having a cavity, an input gate, a bleed off overflow gate in communication with the cavity and a tubular heat pipe charged with phase change media which is capable of being collapsed by imparting an external collapsing pressure. The tubular heat pipe is placed into the cavity in the injection mold apparatus. A net shape moldable thermally conductive material is introduced into the cavity and around the tubular pipe. The bleed off overflow gate is set to open at a predetermined pressure which less than the external collapsing pressure which would damage the heat pipe to be overmolded. Pressure is relieved in the cavity of the mold apparatus through the bleed off overflow gate when pressure in the bleed off overflow gate reaches the predetermined pressure. As a result, delicate heat pipes can be overmolded in an injection mold apparatus without damage to the heat pipe during the molding process.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: April 1, 2003
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6503964
    Abstract: A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency reflective coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electromagnetic interference and radio frequency reflective coating material prevents the absorption and transfer of EMI and RF waves through the filler material thus resulting in an EMI and RF reflective composition.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: January 7, 2003
    Assignee: Cool Options, Inc.
    Inventors: Lyle James Smith, Mikhail Sagal, James D. Miller, Kevin A. McCullough
  • Patent number: 6487073
    Abstract: A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: November 26, 2002
    Assignee: Cool Options, Inc.
    Inventors: Kevin A. McCullough, E. Mikhail Sagal, James D. Miller
  • Patent number: 6478997
    Abstract: A polymer heat pipe with a carbon core and a method of forming such a heat pipe is disclosed. The heat pipe includes a substantially pure carbon fiber core and an outer jacket of substantially pure polymer material. The heat pipe is formed by extruding a mixture of a base of polymer material and a plurality of carbon fibers through an extrusion die. The extrusion die is heated into a range of approximately 250-400° F. to cause the carbon fiber to migrate to the center of the extrudate and the polymer to migrate outwardly. As a result, a jacket of polymer material is formed around a core of carbon fibers to form a highly thermally conductive heat pipe.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: November 12, 2002
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6407149
    Abstract: A method of molding an evenly colored, thermally conductive composition. Thermally conductive filler material is colored and mixed with a base polymer matrix. The mixture is molded into the desired shape. The step of for coloring the filler material is tailored to the type of thermally conductive filler used and could include, as required, anodizing, spraying or dying of the material before mixing with the base polymer matrix and prior to molding.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: June 18, 2002
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6397941
    Abstract: A net-shape molded heat exchanger is provided which includes a thermally conductive main body and a number of thermally conductive arms connected to and extending from the main body. A number of thermally conductive fins are connected to the arms. The heat exchanger is formed by net-shape molding a main body, the arms which emanate from the main body and the fins from a thermally conductive composition, such as a polymer composition. The molded heat exchanger is freely convecting through the part which makes it more efficient and has an optimal thermal configuration. Optionally, heat pipes may be embedded within the arms of the heat exchanger to further enhance heat dissipation.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: June 4, 2002
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough
  • Patent number: 6377219
    Abstract: A net-shape molded composite heat exchanger is provided which includes a plurality of thermally conductive fins overmolded onto one end of a metallic heat pipe for use both as an antenna in a cellular telephone and a heat exchanger to dissipate the heat generated within the device. The heat exchanger is formed by net-shape molding the fins over one end of the heat pipe, from a thermally conductive composition, such as a polymer composition. The molded heat exchanger is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. In addition, the metallic heat pipe serves the additional function of conducting radio frequency waves to and from the cellular telephone device.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: April 23, 2002
    Assignee: Cool Options, Inc.
    Inventor: Lyle James Smith
  • Patent number: 6367541
    Abstract: A conforming heat sink assembly for removing heat from heat generating components, having respective top surfaces defining different heights is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be positioned in flush thermal communication with the top surfaces of each of the components. The bottom portions of a heat dissipating element are embedded in a flexible thermally conductive base member. The heat dissipating member is corrugated to define a number of lower contact points and upstanding fin members. The lower contact points are movable relative to one another in accordance with the top surface of the flexible thermally conductive base member. The heat dissipating element is affixed to the flexible thermally conductive base member at its lower contact points to form a conforming heat sink assembly.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: April 9, 2002
    Assignee: Cool Options, Inc.
    Inventor: Kevin A. McCullough