Abstract: Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

Abstract: A cooling system for computer systems includes one or more cooling hubs and one or more heat spreading devices. The heat spreading devices have nodes and paths defining inner pathways that enclose a two-phase working fluid. The nodes and paths network acts as links for the two-phase working fluid to absorb and transfer thermal energy from the heat-generating components of the electronic device to the cooling hub. The hub-link structure decouples the direct geometrical relationship between heating components and cooling sources to enable a higher degree of design freedom, space management, and cooling redundancy.