Patents Assigned to Core Technology, Inc.
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Patent number: 11935725Abstract: An inductively-coupled plasma (ICP) generation system may include a dielectric tube, a first inductive coil structure to enclose the dielectric tube, an RF power supply, a first main capacitor between a positive output terminal of the RF power supply and one end of the first inductive coil structure, and a second main capacitor between a negative output terminal of the RF power supply and an opposite end of the first inductive coil structure. The first inductive coil structure may include inductive coils connected in series to each other and placed at different layers, the inductive coils having at least one turn at each layer, and auxiliary capacitors, which are respectively provided between adjacent ones of the inductive coils to distribute a voltage applied to the inductive coils.Type: GrantFiled: October 28, 2022Date of Patent: March 19, 2024Assignee: EN2CORE TECHNOLOGY INC.Inventors: Sae Hoon Uhm, Yun Seong Lee
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Patent number: 11909331Abstract: A power supply includes an inverter configured to direct current (DC) power into alternating current (AC) power, an impedance matching circuit configured to supply the AC power to a load; and a controller configured to adjust disposition of a powering period, in which the AC power is output, and a freewheeling period, in which the AC power is not output, to adjust a power amount of the power supplied to the load through the impedance matching circuit by the inverter.Type: GrantFiled: March 17, 2023Date of Patent: February 20, 2024Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Yeong-Hoon Sohn, Se-Hong Park, Sae-Hoon Uhm
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Patent number: 11791133Abstract: A plasma generating apparatus according to an embodiment of the present invention comprises: a pair of electrodes arranged in a dielectric discharge tube; an initial discharge induction coil module; and a main discharge induction coil module. The initial discharge induction coil module and the main discharge induction coil module are connected to an RF power source, and the RF power source provides RF power having different resonance frequencies to the initial discharge induction coil module and the main discharge induction coil module, respectively.Type: GrantFiled: November 15, 2022Date of Patent: October 17, 2023Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Sae Hoon Uhm, Yun Seong Lee, Yeong Hoon Sohn, Se Hong Park
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Patent number: 11632061Abstract: A power supply includes an inverter configured to direct current (DC) power into alternating current (AC) power, an impedance matching circuit configured to supply the AC power to a load; and a controller configured to adjust disposition of a powering period, in which the AC power is output, and a freewheeling period, in which the AC power is not output, to adjust a power amount of the power supplied to the load through the impedance matching circuit by the inverter.Type: GrantFiled: February 17, 2022Date of Patent: April 18, 2023Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Yeong-Hoon Sohn, Se-Hong Park, Sae-Hoon Uhm
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Patent number: 11532455Abstract: A plasma generating apparatus according to an embodiment of the present invention comprises: a pair of electrodes arranged in a dielectric discharge tube; an initial discharge induction coil module; and a main discharge induction coil module. The initial discharge induction coil module and the main discharge induction coil module are connected to an RF power source, and the RF power source provides RF power having different resonance frequencies to the initial discharge induction coil module and the main discharge induction coil module, respectively.Type: GrantFiled: December 27, 2019Date of Patent: December 20, 2022Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Sae-Hoon Uhm, Yun-Seong Lee, Yeong-Hoon Sohn, Se-Hong Park
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Patent number: 11521829Abstract: An inductively-coupled plasma (ICP) generation system may include a dielectric tube, a first inductive coil structure to enclose the dielectric tube, an RF power supply, a first main capacitor between a positive output terminal of the RF power supply and one end of the first inductive coil structure, and a second main capacitor between a negative output terminal of the RF power supply and an opposite end of the first inductive coil structure. The first inductive coil structure may include inductive coils connected in series to each other and placed at different layers, the inductive coils having at least one turn at each layer, and auxiliary capacitors, which are respectively provided between adjacent ones of the inductive coils to distribute a voltage applied to the inductive coils.Type: GrantFiled: December 15, 2020Date of Patent: December 6, 2022Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Sae Hoon Uhm, Yun Seong Lee
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Patent number: 11290028Abstract: A power supply includes an inverter configured to direct current (DC) power into alternating current (AC) power, an impedance matching circuit configured to supply the AC power to a load; and a controller configured to adjust disposition of a powering period, in which the AC power is output, and a freewheeling period, in which the AC power is not output, to adjust a power amount of the power supplied to the load through the impedance matching circuit by the inverter.Type: GrantFiled: June 11, 2018Date of Patent: March 29, 2022Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Yeong-Hoon Sohn, Se-Hong Park, Sae-Hoon Uhm
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Patent number: 11258373Abstract: A power supply includes an inverter configured to convert direct current (DC) power into alternating current (AC) power, an impedance matching circuit configured to supply the AC power to a load, and a controller configured to detect a delay time of an output voltage and an output current output to the impedance matching circuit and the load and to adjust a frequency of the output voltage according to the detected delay time.Type: GrantFiled: June 11, 2018Date of Patent: February 22, 2022Assignee: EN2CORE TECHNOLOGY, INC.Inventors: Yeong-Hoon Sohn, Se-Hong Park, Sae-Hoon Uhm
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Patent number: 11225718Abstract: The present invention improves the in-plane uniformity of film formation via a plasma treatment.Type: GrantFiled: March 3, 2016Date of Patent: January 18, 2022Assignees: CORE TECHNOLOGY, INC., ASKAGI CORPORATIONInventors: Toshiaki Yoshimura, Hiroyuki Minowa, Lung Kei Amos Shek
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Patent number: 11227748Abstract: The present invention improves the in-plane uniformity of films formed via a plasma treatment.Type: GrantFiled: March 3, 2016Date of Patent: January 18, 2022Assignees: CORE TECHNOLOGY, INC., ASKAGI CORPORATIONInventors: Toshiaki Yoshimura, Hiroyuki Minowa, Lung Kei Amos Shek
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Patent number: 11174554Abstract: Provided is a substrate tray which is to be used in a thin-film formation device and makes it easy to improve film quality and film thickness uniformity on a substrate by improving substrate heating efficiency and substrate heating uniformity.Type: GrantFiled: March 3, 2016Date of Patent: November 16, 2021Assignees: CORE TECHNOLOGY, INC., ASKAGI CORPORATIONInventors: Toshiaki Yoshimura, Hiroyuki Minowa, Lung Kei Amos Shek
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Patent number: 11168307Abstract: The invention provides a recombinant or synthetic or engineered or non-naturally occurring poxvirus that contains and expresses DNA encoding a heterologous or exogenous antigen, epitope or immunogen and Flagellin or an operable binding portion thereof. The poxvirus can contain or be engineered to contain and express vaccinia host range gene K1L. The poxvirus can be attenuated as to mammals, e.g., NYVAC, NYVAC.1, NYVAC.2, avipox, canarypox, fowlpox, ALVAC, TROVAC, MVA, or MVA-BN. The invention also provides methods for inducing an immunological response involving the poxvirus, and compositions containing the poxvirus. The antigen, epitope or immunogen that the poxvirus expresses can be at least one Plasmodium antigen. The Plasmodium antigen(s), epitope(s) or immunogen(s) can be SERA, ABRA, Pfhsp70, AMA-1, Pfs25, Pfs16, CSP, PfSSP2, LSA-1 repeatless, MSA-1, AMA-1 or combination(s) thereof.Type: GrantFiled: September 11, 2019Date of Patent: November 9, 2021Assignee: V-CORE TECHNOLOGIES, INC.Inventors: Enzo Paoletti, Randall L. Weinberg, Scott J. Goebel
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Patent number: 10903046Abstract: An inductively-coupled plasma (ICP) generation system may include a dielectric tube, a first inductive coil structure to enclose the dielectric tube, an RF power supply, a first main capacitor between a positive output terminal of the RF power supply and one end of the first inductive coil structure, and a second main capacitor between a negative output terminal of the RF power supply and an opposite end of the first inductive coil structure. The first inductive coil structure may include inductive coils connected in series to each other and placed at different layers, the inductive coils having at least one turn at each layer, and auxiliary capacitors, which are respectively provided between adjacent ones of the inductive coils to distribute a voltage applied to the inductive coils.Type: GrantFiled: December 4, 2019Date of Patent: January 26, 2021Assignee: EN2CORE technology, Inc.Inventors: Sae Hoon Uhm, Yun Seong Lee
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Patent number: 10896806Abstract: An inductively-coupled plasma (ICP) generation system may include a dielectric tube, a first inductive coil structure to enclose the dielectric tube, an RF power supply, a first main capacitor between a positive output terminal of the RF power supply and one end of the first inductive coil structure, and a second main capacitor between a negative output terminal of the RF power supply and an opposite end of the first inductive coil structure. The first inductive coil structure may include inductive coils connected in series to each other and placed at different layers, the inductive coils having at least one turn at each layer, and auxiliary capacitors, which are respectively provided between adjacent ones of the inductive coils to distribute a voltage applied to the inductive coils.Type: GrantFiled: December 4, 2019Date of Patent: January 19, 2021Assignee: EN2CORE technology, Inc.Inventors: Sae Hoon Uhm, Yun Seong Lee
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Patent number: 10541114Abstract: An inductively-coupled plasma (ICP) generation system may include a dielectric tube, a first inductive coil structure to enclose the dielectric tube, an RF power supply, a first main capacitor between a positive output terminal of the RF power supply and one end of the first inductive coil structure, and a second main capacitor between a negative output terminal of the RF power supply and an opposite end of the first inductive coil structure. The first inductive coil structure may include inductive coils connected in series to each other and placed at different layers, the inductive coils having at least one turn at each layer, and auxiliary capacitors, which are respectively provided between adjacent ones of the inductive coils to distribute a voltage applied to the inductive coils.Type: GrantFiled: December 8, 2017Date of Patent: January 21, 2020Assignee: EN2CORE technology, Inc.Inventors: Sae Hoon Uhm, Yun Seong Lee
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Publication number: 20160032499Abstract: There is disclosed a method of making a material comprising an assembly of at least one spun yarn, comprising: synthetic inorganic fibers, such as carbon, metal, oxides, carbides or alloys or combinations thereof, wherein a majority of the fibers: (a) are longer than 300 (b) have a diameter ranging from 0.25 nm and 700 nm, and (c) are substantially crystalline, wherein the yarn has substantial flexibility and uniformity in diameter. In one embodiment, the method comprises spinning yarn by pulling fibers from a bulk material with at least one spinner that has real time feedback controls.Type: ApplicationFiled: March 14, 2014Publication date: February 4, 2016Applicant: COOPER CORE TECHNOLOGIES, INC.Inventor: William Cooper
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Patent number: 8773156Abstract: Methods for measuring insulation resistance in a photovoltaic (PV) array may include partitioning the PV array into groups of PV panels, isolating a group of PV panels selected for an insulation resistance measurement from other groups of panels by setting bypass selectors on each PV panel in the PV array, and making an insulation resistance measurement for the selected group. If a measured value of insulation resistance for a selected group corresponds to an insulation problem in a PV array component, a separate measurement of insulation resistance may be made for each PV panel in the selected group. Insulation resistance measurements may be made accurately and rapidly for large PV arrays without disconnecting and reconnecting cables between panels. Measurements may be made at frequent, regular intervals to permit changes in insulation resistance to be detected before damage from dielectric breakdown occurs.Type: GrantFiled: March 5, 2012Date of Patent: July 8, 2014Assignee: Applied Core Technologies, Inc.Inventors: Shinichi Takada, Toru Takehara
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Patent number: 8593103Abstract: Embodiments of a network topology for monitoring and controlling an array of solar panels include an intelligent node adapted to send and receive data and commands by at least two redundant means of communication. An intelligent node includes a solar panel, a node controller, a photovoltaic module, a bypass relay, a bypass bus, PLC and wireless communication interfaces for redundant means of communication, and sensor and actuator interfaces for monitoring and controlling the intelligent node. A PV module in the intelligent node may selectively be bypassed without interrupting network communications. Some embodiments include a plurality of intelligent nodes electrically connected serially into a chain of nodes and further connected to a gateway. Other embodiments include a plurality of chains of nodes connected to an inverter and a transformer, thereby defining an area. Additional embodiments further include a central server in communication with a plurality of areas.Type: GrantFiled: September 11, 2012Date of Patent: November 26, 2013Assignee: Applied Core Technology, Inc.Inventors: Toru Takehara, Shinichi Takada
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Patent number: 8164995Abstract: A writing current circuit (42) supplies a controlled electrical current to a laser diode (34) for recording data swiftly onto a DVD (16). A plurality of current sources (62) in the writing current circuit (42) supply electrical current directly to the laser diode (34). Each current source (62) respectively receives a single output signal from a current control register (52) included in the writing current circuit (42) which activates or deactivates the current source (62) for supplying a particular quantity of current to the laser diode (34). In one aspect, a pair of current reference signals received by the current source (62) control electrical current supply to the diode (34). Incorporated into these controlling reference signals is a simulation of electrical characteristics of the diode (34). In another aspect, each current source (62) responds to a logical inverse of the output signal from the current control register (52) for controlling overshoot in voltage applied across the diode (34).Type: GrantFiled: December 29, 2010Date of Patent: April 24, 2012Assignee: Silicon Core Technology, Inc.Inventors: Eric Li, Yi Zhang
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Patent number: 7916613Abstract: A writing current circuit (42) supplies a controlled electrical current to a laser diode (34) for recording data swiftly onto a DVD (16). A plurality of current sources (62) in the writing current circuit (42) supply electrical current to the laser diode (34). Each current source (62) respectively receives a single output signal from a current control register (52) included in the writing current circuit (42) which activates or deactivates the current source (62) for supplying a particular quantity of electrical current to the laser diode (34). In each current source (62), electrical current flows to the laser diode (34) through a MOSFET output transistor (142) connected in series with the laser diode (34). Each current source's MOSFET output transistor (142) has a gate insulating layer which is thinner than the gate insulating layer conventionally used for a MOSFET output transistor (142) that is energized by the electrical potential the it applied to the writing current circuit (42).Type: GrantFiled: January 7, 2008Date of Patent: March 29, 2011Assignee: Silicon Core Technology, Inc.Inventors: Eric Li, Yi Zhang