Abstract: A method and apparatus for the tinning or hot solder coating of leads of electronic components wherein the components are individually transported through the tinning process by means of a vacuum gripping device and wherein the planarity and thickness of the solder coating is controlled using pressurized gaseous material.
Abstract: An apparatus for tinning electronic components wherein a plurality of fingers are mounted on a closed loop carrier means for carrying the components through the various steps of the process. The fingers are actuated to move into and out of a component engaging position at different work stations.