Patents Assigned to CYMER-DAYTON, LLC
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Patent number: 10421881Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from to mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: GrantFiled: October 22, 2018Date of Patent: September 24, 2019Assignee: CYMER-DAYTON, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 10301506Abstract: A process for preparing polymer. An embodiment of a method includes generating a resin solution including a first reaction solvent and a polymer resin dissolved therein; deploying the resin solution into a precipitation solvent contained in a chamber of a reaction vessel, wherein deploying the resin solution includes generating droplets of the resin solution; disturbing a resulting mixture of the resin solution and the precipitation solvent, wherein the mixture produces a precipitate; and generating a polymer powder from the mixture, including isolating the precipitate from a remaining portion of the mixture, and drying the isolated precipitate.Type: GrantFiled: August 26, 2016Date of Patent: May 28, 2019Assignee: Cymer-Dayton, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 10280335Abstract: Embodiments generally relate to preparation of polyamide-imide resins using N-Formyl Morpholine:3-Methoxy N,N-Dimethylpropanamide. An embodiment of a method includes generating a polymer solution using a polymerization process, the polymerization process including preparing a solvent including at least N-formylmorpholine (NFM) or a combination of NFM with 3-methoxy N,N-dimethylpropanamide (MDP) as a cosolvent, mixing methylene diphenyl diisocyanate (MDI) and trimellitic anhydride (TMA) with the solvent to generate the polymer solution, and diluting the polymer solution by adding an NFM:MDP solvent mixture or MDP into the generated polymer solution. The method further includes processing the diluted polymer solution to generate polyamideimide polymer or a polyamide-amic acid resin polymer.Type: GrantFiled: August 26, 2016Date of Patent: May 7, 2019Assignee: Cymer-Dayton, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Publication number: 20190112501Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from to mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: ApplicationFiled: October 22, 2018Publication date: April 18, 2019Applicant: CYMER-DAYTON, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 10106702Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from a mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: GrantFiled: August 26, 2016Date of Patent: October 23, 2018Assignee: Cymer-Dayton, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 9815941Abstract: Techniques and mechanisms to reduce toxicity in manufacturing of a polyamideimide and polyamide amic acid resin polymer. In an embodiment, a polyamideimide is produced using at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from the group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ?-caprolactone and methylcyclohexane.Type: GrantFiled: April 15, 2015Date of Patent: November 14, 2017Assignee: CYMER-DAYTON, LLCInventors: Carissa M. Kelly, David E. Noga, John E. Sidenstick, Limor Ben-Asher, Atuso Kondo