Patents Assigned to Cyntec Co., Ltd.
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Patent number: 11967446Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein ?CĂ—Hsat?1800, where ?C is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of ?C0, where ?C0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.Type: GrantFiled: January 4, 2021Date of Patent: April 23, 2024Assignee: CYNTEC CO., LTD.Inventors: Chun-Tiao Liu, Lan-Chin Hsieh, Tsung-Chan Wu, Chi-Hsun Lee, Chih-Siang Chuang
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Publication number: 20240105379Abstract: A magnetic component includes a core, a winding, a lead frame and a conductive material. The winding is disposed in the core. A winding end of the winding extends to an outer periphery of the core. The lead frame is disposed on the outer periphery of the core. At least one hole is formed on the lead frame and corresponds to the winding end. The conductive material is disposed in the at least one hole. The conductive material is in contact with the winding end.Type: ApplicationFiled: July 27, 2023Publication date: March 28, 2024Applicant: CYNTEC CO., LTD.Inventors: Min-Feng Chung, Hao-Chun Chang, Tung-Cheng Chuang
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Publication number: 20240105670Abstract: An electronic component with high coplanarity, including a body with a functional circuit and a mounting plane, a first electrode with a first area deposited on the mounting plane, and a second electrode with a second area deposited on the mounting plane, wherein the first area is larger than the second area, and the first electrode and the second electrode includes a conductive layer and at least one first plating layer over the conductive layer, and a thickness of the conductive layer of the first electrode is smaller than a thickness of the conductive layer of the second electrode, and a thickness of the first plating layer of the first electrode is larger than a thickness of the first plating layer of the second electrode.Type: ApplicationFiled: September 26, 2022Publication date: March 28, 2024Applicant: CYNTEC CO., LTD.Inventor: Chi-Hung Su
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Patent number: 11929460Abstract: A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.Type: GrantFiled: November 27, 2019Date of Patent: March 12, 2024Assignee: CYNTEC CO., LTD.Inventors: Chihung Su, Wenhsiung Liao
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Patent number: 11915855Abstract: A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.Type: GrantFiled: March 17, 2020Date of Patent: February 27, 2024Assignee: CYNTEC CO., LTD.Inventors: Chin Hung Wei, Min Lian Kuo, Chung Kai Liao
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Publication number: 20240029936Abstract: A magnetic component includes a core, at least one coil and a thermal conductive filler. The core includes an inner leg, at least two outer legs and at least one non-bonding region. The at least one coil is wound around the inner leg or the at least two outer legs. The thermal conductive filler covers a part of the core. At least one part of the at least one non-bonding region is not covered by the thermal conductive filler.Type: ApplicationFiled: July 18, 2023Publication date: January 25, 2024Applicant: CYNTEC CO., LTD.Inventors: Hsin-Jung Cheng, Po-Hsiu Chien, Yung-Shou Hsu, Hun-Neng Chen, Hsieh-Shen Hsieh
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Patent number: 11867941Abstract: A light guide assembly, comprising: a substrate and a light guide disposed on the substrate, wherein the top surface of the body comprises a first protrusion having a first slanting surface and a second slanting surface opposite to the first slanting surface for reflecting lights entering into the body, wherein a first outer surface of the body extends from a first lateral surface to the first slanting surface, wherein a highest point of the first slanting surface is located between the first lateral surface and a second lateral surface opposite to the first lateral surface, and a highest point of the second slanting surface is located between the first lateral surface and a lowest point of the second slanting surface.Type: GrantFiled: May 4, 2023Date of Patent: January 9, 2024Assignee: CYNTEC CO., LTD.Inventor: Chi-Jui Yang
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Patent number: 11862835Abstract: The present invention discloses a dielectric filter with multilayer resonator, including a dielectric block, a plurality of multilayer resonator formed in the dielectric block, wherein each multilayer resonator is in a column shape extending in a first direction into the dielectric block and is formed of multiple metal layers paralleling and overlapping each other in a second direction, and vias extend in the second direction and connecting the metal layers in each multilayer resonator, and a ground electrode connected to the ground terminal of each multilayer resonator.Type: GrantFiled: August 4, 2021Date of Patent: January 2, 2024Assignee: CYNTEC CO., LTD.Inventors: Sheng-Ju Chou, Chen-Chung Liu
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Publication number: 20230417805Abstract: A current sensing module includes a shunt resistor for receiving and sensing a current, a digital sensing circuit, and an analog sensing circuit. The shunt resistor includes a connecting part, a first resistive part and a second resistive part coupled in series to the first resistive part via the connecting part. The digital sensing circuit is coupled to the first resistive part for measuring a first analog voltage of the first resistive part when the current flows through the first resistive part, and providing a first digital measuring value associated with the first analog voltage. The analog sensing circuit is coupled to the second resistive part for measuring a second analog voltage of the second resistive part when the current flows through the second resistive part, and providing a second analog measuring value associated with the second analog voltage.Type: ApplicationFiled: June 20, 2023Publication date: December 28, 2023Applicant: CYNTEC CO., LTD.Inventors: Tzu-Hao Hung, Shu-Wei Hsu
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Patent number: 11848146Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.Type: GrantFiled: May 12, 2021Date of Patent: December 19, 2023Assignee: CYNTEC CO., LTD.Inventors: Da-Jung Chen, Chien Ming Chen
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Patent number: 11798735Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.Type: GrantFiled: January 13, 2021Date of Patent: October 24, 2023Assignee: CYNTEC CO., LTD.Inventors: Kuan Yu Chiu, Ching Hsiang Yu, Min-Feng Chung
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Publication number: 20230335327Abstract: A method of fabricating a magnetic component structure with thermal conductive filler, including steps of providing a mold with a coil mounted therein, potting the mold with a thermal conductive material to form a thermal conductive filler encapsulating at least a portion of said coil, releasing the thermal conductive filler and the coil from the mold, and combining the thermal conductive filler with magnetic cores to form a magnetic component structure.Type: ApplicationFiled: June 8, 2023Publication date: October 19, 2023Applicant: CYNTEC CO., LTD.Inventors: Yi-Ting Lai, Jen-Chuan Hsiao, Yuan-Ming Chang, Hsieh-Shen Hsieh
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Patent number: 11791079Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.Type: GrantFiled: March 17, 2020Date of Patent: October 17, 2023Assignee: CYNTEC CO., LTD.Inventors: Min-Feng Chung, Ching Hsiang Yu, Kuan Yu Chiu, Yu-Hsin Lin
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Publication number: 20230327216Abstract: A lithium-ion coin battery having a winding core as an anode lead and a cathode lead is provided in the present invention, including a winding core having a first electrode section, a second electrode section and an insulating section isolating the first electrode section and the second electrode section, an electrode winding having a first electrode sheet, a second electrode sheet and a separator isolating between the first electrode sheet and the second electrode sheet, wherein the electrode winding winds on the winding core, and the first electrode sheet is electrically coupled with the first electrode section of the winding core, the second electrode sheet is electrically coupled with the second electrode section of the winding core, and the separator is coupled with the insulating section of the winding core.Type: ApplicationFiled: January 9, 2023Publication date: October 12, 2023Applicant: CYNTEC CO., LTD.Inventors: Pei-I Wei, Chih-Hsuan Chang
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Patent number: 11783992Abstract: An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.Type: GrantFiled: July 23, 2020Date of Patent: October 10, 2023Assignee: CYNTEC CO., LTD.Inventors: Pei-I Wei, Cheng-Hao Chang, Shing Tak Li
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Patent number: 11769621Abstract: A method to form an electrical component, comprising: overlaying a conductive and adhesive layer on a body and covering a first portion of a terminal part of a conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the conductive and adhesive layer; and overlaying at least one metal layer on the conductive and adhesive layer and covering the second portion of the terminal part of the conductive element, wherein the at least one metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.Type: GrantFiled: January 1, 2020Date of Patent: September 26, 2023Assignee: CYNTEC CO., LTD.Inventors: Chi-Hsun Lee, Hsieh-Shen Hsieh, Sen-Huei Chen
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Patent number: 11744009Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.Type: GrantFiled: September 17, 2021Date of Patent: August 29, 2023Assignee: CYNTEC CO., LTD.Inventors: Kaipeng Chiang, Da-Jung Chen, Bau-Ru Lu, Chun Hsien Lu
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Patent number: 11710595Abstract: An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.Type: GrantFiled: March 4, 2020Date of Patent: July 25, 2023Assignee: CYNTEC CO., LTD.Inventors: Yi-Ting Lai, Jen-Chuan Hsiao, Yuan-Ming Chang, Hsieh-Shen Hsieh
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Publication number: 20230223187Abstract: A magnetic component includes a first core, a second core, an outer bobbin, a first winding, an inner bobbin and a second winding. The outer bobbin is disposed between the first core and the second core. The outer bobbin has a hollow tube portion, a first bottom portion and a first top portion. The first winding is wound around outer side of the hollow tube portion. The inner bobbin is disposed in the hollow tube portion. The inner bobbin has a second bottom portion and a second top portion. The second winding is wound around the inner bobbin. The second bottom portion is exposed to bottom side of the first bottom portion, such that the first bottom portion overlaps the second bottom portion in a height direction of the magnetic component. The second top portion and the second bottom portion abut against inner side of the hollow tube portion.Type: ApplicationFiled: January 11, 2022Publication date: July 13, 2023Applicant: CYNTEC CO., LTD.Inventors: Kun-Ping Chiu, Yu-Lin Hsueh
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Patent number: 11688533Abstract: A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.Type: GrantFiled: November 2, 2021Date of Patent: June 27, 2023Assignee: CYNTEC CO., LTD.Inventors: Hsiu-Yu Chang, Chao-Ting Lin