Abstract: A composite magnetic component is provided. The composite magnetic component includes a magnetic flux-guiding unit, a first coil structure and a second coil structure. The first coil structure and the second coil structure are wound around a first winding portion and a second winding portion of the magnetic flux-guiding unit, respectively. A first magnetic flux results from the first coil structure and the magnetic flux-guiding unit. A second magnetic flux results from the second coil structure and the magnetic flux-guiding unit. The first magnetic flux is orthogonal to the second magnetic flux within the magnetic flux-guiding unit.

Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.

Abstract: A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.

Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.

Abstract: An optical fiber strip has a stair-shaped base element, a cover element, an adapter and an internal optical fiber array. The stair-shaped base element has a plurality of holes and a first bearing surface. The holes are integrally formed and extends from the first receiving surface to a bottom surface of the stair-shaped base element. The cover element includes an internal curved space between the first curved part and second curved part. The internal optical fiber array is selectively and optically coupled to tan optical-electrical conversion unit via the holes. A curved portion of the internal optical fiber array is located in the internal curved space for changing direction of the internal optical fiber array.

Abstract: Mixed magnetic powders for making a magnetic core or body is disclosed, wherein the mixed magnetic powders comprises a first magnetic powder and a second magnetic powder, each of the first magnetic powder and the second magnetic powder being made of a soft magnetic material, wherein the average particle diameter of the first magnetic powder is greater than that of the second magnetic powder, and each of the first magnetic powder and the second magnetic powder has a pre-configured particle size distribution for increasing the density of the magnetic body.

Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

Abstract: A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.

Abstract: A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component.

Abstract: A composite material of an electrode unit includes: a porous electrode material being 50˜95 wt % of the composite material; an electret material being greater than 0 wt % and less than 15 wt % of the composite material; a dispersant material being 0˜15 wt % of the composite material; an adhesive material being 0˜15 wt % of the composite material; an electric conduction auxiliary agent being greater than 0 wt % and less than 30 wt % of the composite material. The porous electrode material includes porous particles and the electret material is distributed among the porous particles.

Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.

Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.

Abstract: The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that the size of electronic package structure can be reduced. The three-dimensional package structure comprises a substrate, a first plurality of discrete conductive components and a connecting structure. The substrate has a top surface and a bottom surface. The first plurality of discrete conductive components are disposed over the bottom surface of the substrate. The connecting structure is disposed over the bottom surface of the substrate for encapsulating the first plurality of discrete electronic components. The connecting structure comprises at least one insulating layer and a plurality of conductive patterns separated by the at least one insulating layer. The plurality of conductive patterns are disposed over the first plurality of discrete electronic components for electrically connecting the first plurality of discrete electronic components.

Abstract: An electronic component is disclosed, wherein electronic component comprises: a body; a conductive element disposed in the body; a first lead disposed on the body, wherein a first part of the first lead is disposed on a first surface of the body, a second part of the first lead is disposed on a second surface of the body and a third part of the first lead is disposed on a third surface of the body, wherein the first surface, the second surface and the third surface of the body are not coplanar with each other, wherein the first lead is electrically connected to the conductive element.

Abstract: An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height.

Abstract: The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.

Abstract: A magnetic element includes a first magnetic core, a second magnetic core and a plurality of conducting wires. The first magnetic core includes a first coiling body, a first protruding portion and a second protruding portion. The second magnetic core includes a second coiling body, a third protruding portion and a fourth protruding portion. A soldering surface of the first protruding portion is parallel and next to a soldering surface of the fourth soldering surface. Since an extension direction of the first magnetic core is extended from the soldering surface of the first protruding portion, an extension direction of the second magnetic core is extended from the soldering surface of the second protruding portion, and the plurality of conducting wires can be coiled on the first and the second coiling bodies respectively, the transformer can provide more space for coiling than the prior art.

Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element disposed in the body, wherein at least one portion of a terminal part of the conductive element is exposed outside of the body; a metal foil having an adhesive material on the bottom surface thereof, the metal foil being adhered on the body through the adhesive material and covering a first portion of the terminal part of the conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the metal foil; and a metal layer, overlaying on the metal foil and covering the second portion of the terminal part of the conductive element, wherein the metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.