Abstract: The present invention relates to compositions for the chemical mechanical planarization (“CMP”) of barrier/adhesion layers, particularly Ta/TaN barrier/adhesion layers as occur in the manufacture of integrated circuits. CMP compositions comprise an aqueous solution of oxidizer and colloidal silica abrasive. Oxidizers include hydroxylamine nitrate, nitric acid, benzotriazole, ammonium nitrate, aluminum nitrate, hydrazine and mixtures thereof in aqueous solution.
Type:
Grant
Filed:
September 22, 2003
Date of Patent:
April 25, 2006
Assignee:
DANanoMaterials LLC
Inventors:
Robert J. Small, Maria Peterson, Tuan Truong, Melvin Keith Carter, Lily Yao