Patents Assigned to DAEVAC International Co., Ltd.
  • Patent number: 11085126
    Abstract: A feed assembly supplies polysilicon to a growth chamber for growing a crystal ingot from a melt. An example system includes a housing having support rails for receiving one of a granular tray and a chunk tray and a feed material reservoir positioned above the support rails to selectively feed one of either the granular tray or the chunk tray. A valve mechanism and pulse vibrator are also disclosed.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: August 10, 2021
    Assignees: GlobalWafers Co., Ltd., Daevac International Co., Ltd.
    Inventors: Seok Min Yun, Seong Su Park, Jun Hwan Ji, Won-Jin Choi, UiSung Jung, Young Jung Lee, Tae Su Koo, Sung-Jin Kim
  • Patent number: 10273596
    Abstract: A feed assembly supplies polysilicon to a growth chamber for growing a crystal ingot from a melt. An example system includes a housing having support rails for receiving one of a granular tray and a chunk tray and a feed material reservoir positioned above the support rails to selectively feed one of either the granular tray or the chunk tray. A valve mechanism and pulse vibrator are also disclosed.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: April 30, 2019
    Assignees: GLOBALWAFERS CO., LTD., DAEVAC INTERNATIONAL CO., LTD.
    Inventors: Seok Min Yun, Seong Su Park, Jun Hwan Ji, Won-Jin Choi, UiSung Jung, Young Jung Lee, Tae Su Koo, Sung-Jin Kim
  • Publication number: 20180237948
    Abstract: A feed assembly supplies polysilicon to a growth chamber for growing a crystal ingot from a melt. An example system includes a housing having support rails for receiving one of a granular tray and a chunk tray and a feed material reservoir positioned above the support rails to selectively feed one of either the granular tray or the chunk tray. A valve mechanism and pulse vibrator are also disclosed.
    Type: Application
    Filed: August 18, 2016
    Publication date: August 23, 2018
    Applicants: SunEdison Semiconductor Limited (UEN201334164H), DAEVAC International Co., Ltd.
    Inventors: Seok Min Yun, Seong Su Park, Jun Hwan Ji, Won-Jin Choi, UiSung Jung, Young Jung Lee, Tae Su Koo, Sung-Jin Kim