Patents Assigned to Dai-Ichi Seiko Kabushiki Kaisha
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Patent number: 4934577Abstract: A guide post for magnetic tapes manufactured by injection molding of a composite material prepared by mixing a thermoplastic resin used as a basic ingredient with an electrically conductive carbon black and a spherical silicon resin. This guide post can exhibit characteristics equivalent to those of the metal guide post owing to the function of the electrically conductive carbon black and the spherical silicon resin. The composite material can further contain a solid lubricant mixed therewith.Type: GrantFiled: December 27, 1988Date of Patent: June 19, 1990Assignee: Dai-ichi Seiko Kabushiki KaishaInventors: Toshiaki Sugimoto, Mayumi Endou, Isamu Kaneko
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Patent number: 4872850Abstract: An IC tester socket comprises a spring for keeping the socket body and the spacer frame in their state of being spaced apart from each other with a predetermined interval; and contacting pins each having a spring portion shaped in a pair of arcuate forms, in order to ensure the contact between the lead terminals of an IC requiring testing and the contacting pins to be realized positively and stably and to make it possible for the socket to stand its use for a prolonged period of time. The arm of each contacting pin which is brought into contact with the side face to its mating lead terminal of the IC is adapted to contact the side face of the lead terminal, and is so shaped as to be able to lock the IC package at the position of contact of this arm.Type: GrantFiled: June 8, 1988Date of Patent: October 10, 1989Assignee: Dai-ichi Seiko Kabushiki KaishaInventors: Hiroyuki Mogi, Kazuhisa Ozawa
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Patent number: 4799897Abstract: An IC tester socket comprises a spring for keeping the socket body and the spacer frame in their state of being spaced apart from each other with a predetermined interval; and contacting pins each having a spring portion shaped in a pair of arcuate forms, in order to ensure the contact between the lead terminals of an IC requiring testing and the contacting pins to be realized positively and stably and to make it possible for the socket to stand its use for a prolonged period of time. The arm of each contacting pin which is brought into contact with the side face to its mating lead terminal of the IC is adapted to contact the side face of the lead terminal, and is so shaped as to be able to lock the IC package at the position of contact of this arm.Type: GrantFiled: December 23, 1986Date of Patent: January 24, 1989Assignee: Dai-ichi Seiko Kabushiki KaishaInventors: Hiroyuki Mogi, Kazuhisa Ozawa
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Patent number: 4701024Abstract: In order to make it possible to be adapted to be used for an integrated liquid crystal panel having a built-in direct touch-entry enabling device, a liquid crystal material made by dispersing many needle-shaped magnetic substance particles respectively coated with a surface active agent in a well known liquid crystal substance and a method of making the same. The liquid material can be utilized in the form of many encapsulated liquid material units combined with one another. In case such encapsulated liquid crystal material is used for a liquid crystal device, it need not be sealed with glass or the like and can be directly applied to paint any required part and, even if the painted part is curved during the use, it can develop its performance.Type: GrantFiled: December 1, 1986Date of Patent: October 20, 1987Assignee: Dai-ichi Seiko Kabushiki KaishaInventors: Shunsuke Kobayashi, Yoshihiko Matsuyama, Masayoshi Koutake
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Patent number: 4691975Abstract: In order to construct an IC-tester socket as a whole into a compact size and to make the mounting and removal of an IC package easy and further to enable stable and positive contact between the lead terminals of the IC package and contact pins, the IC-tester socket is comprised of a socket body capable of accomodating an IC package; a plurality of contact pins provided within the socket body and each having resilient first and second arms capable, in their normal state, of nipping each said lead terminal; and releasers mounted vertically movably on the socket body for being able to release the nipping of the lead terminals done by these first and second arms.Type: GrantFiled: October 21, 1986Date of Patent: September 8, 1987Assignee: Dai-Ichi Seiko Kabushiki KaishaInventors: Masami Fukunaga, Tomoyoshi Yamaguchi