Abstract: A printing plate for screen printing to form a prescribed pattern with ink on an object includes: a plate of a prescribed material having a first surface and a second surface and divided at a distribution in accordance with the prescribed pattern into a first part and a second part. The first part has small apertures allowing the ink to be pressed out from the first surface to the second surface formed therein. The second part does not allow the ink to be transferred from the first surface to the second surface. The printing plate further includes a thin partition formed along the boundary of the first part and the second part and protruding by a prescribed uniform height from the second surface. The thin partition is for limiting within the second part the spreading of the ink on an object which is pressed out through the small apertures to the second surface of the second part. A process of manufacturing such a printing plate is also disclosed.

Abstract: A D-A converter outputs feed pitch error signals on an exposure head. The error signals are inverted to be supplied to a multiplier, and non-inverted to be supplied to a second multiplier. The exposure head radiates multiple beams, and ON/OFF dot signal for odd channels thereof are supplied to the multiplier and ON/OFF dot signals for even channels are supplied to the second multiplier respectively. The multipliers multiply the supplied signals, whereby values of the ON/OFF dot signals are changed in response to the errors. Thus, the beams outputted from the respective channels are controlled in power intensity, whereby diameters of printing spots on photosensitive material are changed per channel.

Abstract: A probing apparatus is used to measure electrical characteristics of a semiconductor device formed on a wafer. The apparatus includes means for holding the wafer in a vertical or slightly leaned position on a frame, a contact needle, three-directional drive means for holding the needle on the frame movably both vertically and horizontally along the device-bearing surface of the wafer and for bringing the needle into releasable contact with a desired portion of the device-bearing surface of the wafer, and a microscope provided in such a way that the tip of the needle is seen substantially at the center of the field of view, said microscope being movable together with the needle along the device-bearing surface of the wafer.