Patents Assigned to Dasan C & I Co., Ltd.
  • Patent number: 6449873
    Abstract: Disclosed is a dry cleaning apparatus and method using cluster for cleaning a surface of a specimen such as semiconductor wafer. The cleaning method first forms a neutral cluster no having polarity by passing a cleaning gas such as argon, nitrogen, or carbon dioxide gas through a sand glass-shaped nozzle. The formed neutral cluster is injected at an acute angle with respect to a surface of the specimen, thereby removing particles or organic remnants attached on the surface of the specimen without damaging the surface of the specimen.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: September 17, 2002
    Assignee: Dasan C & I Co., Ltd.
    Inventors: Deok-Joo Yoon, Myeon-Chang Sung, Kwang-Ho Jeong
  • Patent number: 6279650
    Abstract: A temperature-humidity controller for a semiconductor equipment comprises a housing; an inlet pipe for introducing processing air, which has a discharging portion for flowing the air into an inner portion of the housing; a water supplying means for supplying water into the inner portion of the housing so as to contact with the processing air from the discharging portion of the inlet pipe thereby simultaneously performing dehumidifying and humidifying processes; a cooling means for cooling the water at a dew point; a heating means for heating the air at a desired temperature, which is dehumidified and humidified by the water supplying means; an outlet pipe for supplying the heated air to the semiconductor equipment.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: August 28, 2001
    Assignee: Dasan C & I Co., Ltd.
    Inventor: Myeon-Chang Sung
  • Patent number: 5833096
    Abstract: A water dispenser for dispensing bottled water with the water bottle installed into the bottom portion of a dispenser cabinet with the water bottle's open end up, thereby eliminating the need to lift the water bottle to the top of the cabinet and the need to invert the bottle so that its open end points down.
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: November 10, 1998
    Assignee: Dasan C&I Co. Ltd.
    Inventor: H. B. Ohu