Patents Assigned to DeCorp Americas, Inc.
  • Non-uniform transmission line and method of fabricating the same
    Patent number: 6774741
    Abstract: A non-uniform transmission line includes at least one patterned conductive layer, a dielectric layer adjacent to the patterned conductive layer(s), and an insulating layer surrounding the patterned conductive layer(s) and the dielectric layer.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: August 10, 2004
    Assignee: DeCorp Americas, Inc.
    Inventors: Michael W. McCurdy, David Murray, James M. Potter, Robert J. Sexton, Linda Sue Walling
  • Device and method for connecting wire
    Patent number: 6688912
    Abstract: A device for connecting wire includes a conductive rod having a first slot for inserting a conductor of a wire, and an insulating sleeve covering a portion of the conductive rod, the insulating sleeve having a second slot through which the conductor contacts the conductive rod.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: February 10, 2004
    Assignee: DeCorp Americas, Inc.
    Inventors: Abraham Eastman, David Murray, Brent Myers, Terry Oquin, Robert Sexton
  • Device and method for connecting wire
    Publication number: 20030153208
    Abstract: A device for connecting wire includes a conductive rod having a first slot for inserting a conductor of a wire, and an insulating sleeve covering a portion of the conductive rod, the insulating sleeve having a second slot through which the conductor contacts the conductive rod.
    Type: Application
    Filed: February 14, 2002
    Publication date: August 14, 2003
    Applicant: DeCorp Americas, Inc.
    Inventors: Abraham Eastman, David Murray, Brent Myers, Terry Oquin, Robert Sexton
  • Flat surface-mounted multi-purpose wire
    Patent number: 6492595
    Abstract: A multi-purpose wire includes at least one elongated conductor having a width of at least 0.125 inches. The conductor includes at least one conductive layer having a thickness no greater than about 0.0200 inches. The wire also includes a bonding material between each conductor, and an insulation layer surrounding the conductor and bonding material.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: December 10, 2002
    Assignee: DeCorp Americas, Inc.
    Inventor: Robert Jay Sexton