Abstract: A flux based on inorganic boron and/or halogen compounds for brazing difficult to wet metallic materials with silver- and copper-based solders, which contains, as an activating addition, based on the total amount of the flux, 0.01-10 wt. % of elemental boron and 0.01-10 wt. % of at least one of the elements Mo, W, Mn, Co, Ni, Pd, Cu or Ag in the form of elements, alloys or compounds. The activating addition brings about a substantial increase in the wettability by the solder, particularly in the case of difficult to wet stock materials.
Type:
Grant
Filed:
May 5, 2000
Date of Patent:
September 2, 2003
Assignee:
Degussa-Huls Aktingesellschaft
Inventors:
Jürgen Koch, Sandra Wittpahl, Wolfgang Weber, Wolfgang Kohlweiler