Abstract: An active temperature control system for a DUT utilizes a heat sink containing HFE7100 liquid and an electric heater. The liquid is cooled below the set point and the heater is used to bring the DUT up to the set point. Set points in the range of −10 degrees C. to +110 degrees C. can be achieved. The heat sink utilizes only a single coolant for all of the set points, allowing set points to be changed within a few minutes. At a given set point, the heater provides a quick response to offset the effect of self-heating and keep the set point deviation to within a few degrees C. Power following techniques can be utilized to achieve the quick response.

Abstract: The power of a device under test (DUT) is monitored without reliance on dedicated current and voltage monitoring signals available from a semiconductor test unit. One or more magneto-resistive current sensors are provided external to, and in between the DUT and a power source. The current sensor(s) provide a detection signal proportional to the current drawn by the device from the power source. A monitoring circuit multiplies the detected current by the core voltage supply to the DUT to obtain a signal representative of the power of the device. The power signal is provided to a control circuit that operates a heat exchanger, such as on active conductive heat exchanger, to adjust the temperature of the device based on the signal representative of the power of the device. In this way the temperature of the DUT can be maintained at or near a constant set point.

Abstract: A system and method for controlling a temperature of a device during testing with a thermal controller and a heat exchanger includes measuring an instantaneous power consumption of the device during testing. The heat exchanger is controlled with the thermal controller using the measured instantaneous power consumption by the device to regulate the temperature of the device during testing, wherein the heat exchanger is in conductive contact with the device.

Abstract: A method of controlling a temperature of a semiconductor device during testing is used with a system including a heater and a heat sink and a temperature control system. The semiconductor device is thermally coupled to the heater, which is thermally coupled to a heat sink. The heat sink defines a chamber, and the chamber is adapted to have a liquid flowing through the chamber. The temperature control system is coupled to the heater and the heat sink. In the method, the temperature of the semiconductor device is moved to approximately a first set point temperature. The temperature of the semiconductor device is moved to approximately a second set point temperature, from approximately the first set point temperature, by changing a temperature of the heater and maintaining the liquid flowing into the chamber at a substantially constant temperature.

Abstract: A method for controlling the temperature of a DUT during a testing operation, includes a) measuring a parameter related to power consumption by the DUT during testing, such as current consumption; and b) using the parameter related to power consumption to operate a temperature control device to compensate for temperature change due to changes in power consumption by the DUT during testing. The control can be closed loop or open loop with control signals incorporated into a test program. Apparatus for controlling the temperature of a DUT during testing, includes a) a device for measuring a parameter related to power consumption by the DUT during testing; b) a temperature control device which operates to control the temperature of the DUT during test; and c) a device for controlling operation of the temperature control device according to the measured parameter related to power consumption.

Abstract: A method for controlling a device temperature measures a parameter related to device power consumption and utilizes the parameter to control the device temperature. This can be achieved with a system including a heat exchanger, a power monitor, and a circuit which controls the temperature setting of the heat exchanger. The circuit uses as inputs the power level, heat exchanger temperature, and set point. The system thus eliminates the need for temperature sensing devices in or connected to a chip, responds to the temperature of the device and not the package, can be used for high volume chip manufacturing, does not require significant surface area of a device for temperature sensing, and eliminates the need for chip power profiles. Significantly, the system allows a set point to be maintained with minimal overshoot or undershoot.

Abstract: A method for controlling the temperature of a DUT during a testing operation, includes a) measuring a parameter related to power consumption by the DUT during testing, such as current consumption; and b) using the parameter related to power consumption to operate a temperature control device to compensate for temperature change due to changes in power consumption by the DUT during testing. The control can be closed loop or open loop with control signals incorporated into a test program. Apparatus for controlling the temperature of a DUT during testing, includes a) a device for measuring a parameter related to power consumption by the DUT during testing; b) a temperature control device which operates to control the temperature of the DUT during test; and c) a device for controlling operation of the temperature control device according to the measured parameter related to power consumption.

Abstract: An IC handler inverts an IC in a single motion by first gripping the IC with two fingers attached to an arm and then flipping the IC over by rotating the arm in a one-hundred eighty degree arc. The fingers maintain contact with the IC during the entire one-hundred eighty degree motion. The fingers grip the IC from the sides so that they can drop the IC onto a carrier after flipping the IC. After flipping, the IC is lowered onto the carrier by an air cylinder until two precising pins engage the carrier. The IC can thus be delivered to a testing device with its electrical contacts facing up.

Abstract: An active temperature control system for a DUT utilizes a heat sink containing HFE7100 liquid and an electric heater. The liquid is cooled below the set point and the heater is used to bring the DUT up to the set point. Set points in the range of −10 degrees C. to +110 degrees C. can be achieved. The heat sink utilizes only a single coolant for all of the set points, allowing set points to be changed within a few minutes. At a given set point, the heater provides a quick response to offset the effect of self-heating and keep the set point deviation to within a few degrees C. Power following techniques can be utilized to achieve the quick response.

Abstract: A method of controlling a temperature of a semiconductor device during testing is used with a system including a heater and a heat sink and a temperature control system. The semiconductor device is thermally coupled to the heater, which is thermally coupled to a heat sink. The heat sink defines a chamber, and the chamber is adapted to have a liquid flowing through the chamber. The temperature control system is coupled to the heater and the heat sink. In the method, the temperature of the semiconductor device is moved to approximately a first set point temperature. The temperature of the semiconductor device is moved to approximately a second set point temperature, from approximately the first set point temperature, by changing a temperature of the heater and maintaining the liquid flowing into the chamber at a substantially constant temperature.

Abstract: An apparatus for handling electronic devices in a system that assigns a category corresponding to one of a plurality of predetermined categories to the electronic devices and sorts the electronic devices according to the categories is provided. A plurality of platforms, each for supporting one tray that carries one or more electronic devices, and each platform corresponding to one of the categories, are vertically stacked in a predetermined order according to the plurality of categories. A group of the stacked platforms are separated from a platform located at a first position corresponding to a particular category corresponding to the category of an electronic device to expose a tray and enable the electronic device to be placed on the tray. A method of handling electronic devices is also provided.

Abstract: A contactor apparatus for electrically interconnecting a lead of an electrical device to a conductive area on a board. The contactor apparatus includes a housing having a slot. It also includes a probe disposed within the slot, the probe having a fulcrum for engaging the conductive area on the board and an arm for engaging the lead of the electrical device. The contactor apparatus further includes an elastomeric element disposed transverse the slot and engaging the probe, wherein as the lead of the electrical device engages the arm, the probe pivots within the slot about said fulcrum, the fulcrum rocking on the conductive area of the board. The contactor apparatus may also include a manual nest for holding the electrical device. The manual nest has a handler for securing the electrical device within the housing, the handler having an open window for accessing the lead of the electrical device when the manual nest is inserted into the housing.

Abstract: An apparatus and method for picking up parts from a conveyor belt, moving them to a test rig for testing, and returning tested parts to the belt, in which a rotatable shaft is rotated back and forth between first and second positions. The shaft carries first and second pick-up heads at its free end, which are oriented perpendicular to one another and at angles of 45.degree. to the shaft. In the first position, the first pick-up head is aligned with a conveyor while the second pick-up head is aligned with a test rig, while the pick-up head positions are reversed in the second position. First and second drive assemblies are arranged to drive each of the pick-up heads between extended and retracted positions in each of the two rotatable shaft positions. In each of the first and second positions, one of the pick-up heads deposits a tested part onto the conveyor and picks up a new part for testing while the other pick-up head holds a part for testing at the test rig.

Abstract: A feed and storage track which will hold DIP devices of three different widths in aligned rows, such as during treatment in an environmental chamber, and which will facilitate precise individual feed of the devices to a handling or testing station. The track has three rails with spacings to fit the three sizes of DIP devices straddling specific pairs of rails. A three pronged input head is adjustably mounted on one end of the track to feed DIP devices from a standard storage sleeve onto the appropriate rails.