Patents Assigned to DENKA COMPANY LIMITED
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Publication number: 20240158555Abstract: A chloroprene polymer having a structural unit derived from chloroprene and a structural unit derived from an unsaturated nitrile, in which the chloroprene polymer has peak tops at 5.80 to 6.00 ppm and 5.10 to 5.30 ppm in a 1H-NMR spectrum as measured in a deuterochloroform solvent, in the 1H-NMR spectrum, a peak area ratio A/B of a peak area A at 5.80 to 6.00 ppm and a peak area B at 4.05 to 6.20 ppm is 0.9/100 to 1.1/100, and the peak area A, the peak area B, and a peak area C at 5.10 to 5.30 ppm satisfy formula “(C?2A)/B?2.0/100”, and a content of the structural unit derived from an unsaturated nitrile is more than 0% by mass and 23% by mass or less.Type: ApplicationFiled: March 7, 2022Publication date: May 16, 2024Applicant: Denka Company LimitedInventors: Wataru NISHINO, Suguru ONUKI, Ryotaro ANDO
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Publication number: 20240158609Abstract: An inorganic powder having a volume-based cumulative 50% diameter D50 of 1.2-2.8 ?m, having a volume-based particle size frequency distribution that includes at least a first peak and a second peak located on a larger-particle-diameter side of the first peak, wherein the first peak has a half-width smaller than 0.5 ?m.Type: ApplicationFiled: March 24, 2022Publication date: May 16, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takaaki MINAMIKAWA, Akihiko YAMAMOTO, Takashi FUKUDA
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Publication number: 20240158230Abstract: A method for producing a boron nitride particle, including: a step of pressurizing and heating a particle containing boron carbide under a nitrogen atmosphere to obtain a particle containing boron carbonitride; a step of putting a mixture containing a boron source containing at least one selected from the group consisting of boric acid and boron oxide and the particle containing boron carbonitride into a container; and a step of pressurizing and heating the mixture under a nitrogen atmosphere in a state where airtightness in the container has been enhanced to obtain a boron nitride particle, wherein an amount of boron atoms in the boron source is 1.0 to 2.2 mol with respect to 1 mol of the boron carbonitride in the mixture.Type: ApplicationFiled: March 22, 2022Publication date: May 16, 2024Applicant: DENKA COMPANY LIMITEDInventors: Yusuke SASAKI, Kenji MIYATA, Kei KUBOBUCHI, Takako ARAI
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Publication number: 20240158242Abstract: A silicon dioxide powder has a uranium content of 0.8 ppb by mass or less and a sphericity of 0.80 or more. The silicon dioxide powder has a low uranium content and a high sphericity.Type: ApplicationFiled: March 22, 2022Publication date: May 16, 2024Applicant: DENKA COMPANY LIMITEDInventors: Takaaki MINAMIKAWA, Hiroyuki SHIOTSUKI, Koji MIYAZAKI
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Publication number: 20240156943Abstract: An influenza vaccine that has high immunogenicity in children and elderly people and has a higher efficacy than conventional split vaccines. An influenza vaccine composition to be administered to children and/or elderly people, including, as a virus antigen, inactivated whole particles subjected to inactivation treatment with beta-propiolactone.Type: ApplicationFiled: March 29, 2022Publication date: May 16, 2024Applicant: DENKA COMPANY LIMITEDInventors: Ryotaro MITSUMATA, Tomohiro NARAHARA
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Patent number: 11984291Abstract: A method for manufacturing an electron source includes steps of sandwiching a welding object in which a tip of an electron emission material and a tungsten filament overlap in direct contact between a pair of welding electrodes, and welding the tip and the tungsten filament by causing a current to flow while pressing forces are applied to the welding object by the pair of welding electrodes. A thickness of the welding object is within a range of 50 to 500 ?m.Type: GrantFiled: December 20, 2021Date of Patent: May 14, 2024Assignee: Denka Company LimitedInventor: Hiromitsu Chatani
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Patent number: 11983586Abstract: A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.Type: GrantFiled: March 25, 2021Date of Patent: May 14, 2024Assignee: DENKA COMPANY LIMITEDInventors: Daisuke Goto, Hiroaki Ota
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Publication number: 20240150184Abstract: Silica powder having a dielectric loss tangent of 0.004 or less, in which the number of silicon metal particles in 10 g of the silica powder is 30 or less. A method for producing silica powder, including a heating step of heating silica powder in the presence of chlorine. Silica powder having a low dielectric loss tangent and a low silicon metal content, and a method for producing the silica powder can be provided.Type: ApplicationFiled: March 11, 2022Publication date: May 9, 2024Applicant: DENKA COMPANY LIMITEDInventors: Hiroyuki SHIOTSUKI, Takaaki MINAMIKAWA, Koji MIYAZAKI
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Publication number: 20240150647Abstract: A phosphor powder consisting of a red phosphor represented by a general formula (Srx, Ca1-x-y, Euy)AlSi(N,O)3 having the same crystal phase as that of CaAlSiN3. In the general formula, relationships of x<1 and 1?x?y>0 are satisfied. In a case where a cumulative 10% value of the phosphor powder in a volume-based particle size distribution curve is defined as D10, a cumulative 50% value is defined as D50, and a cumulative 90% value is defined as D90, a value of D50 is more than 20 ?m and 40 ?m or less, and a value of (D90?D10)/D50 is 1.12 or less.Type: ApplicationFiled: March 11, 2022Publication date: May 9, 2024Applicant: DENKA COMPANY LIMITEDInventors: Moeko TANAKA, Tomohiro NOMIYAMA
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Publication number: 20240153730Abstract: An emitter includes an insulator, a pair of terminals attached to the insulator separately from each other, at least one filament attached between the pair of terminals in an arch shape, and an electron source fixed to the filament. The filament has bent portions between a contact with respect to the electron source and contacts with respect to the terminals. A device is provided with the emitter.Type: ApplicationFiled: March 9, 2022Publication date: May 9, 2024Applicant: Denka Company LimitedInventor: Daisuke ISHIKAWA
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Patent number: 11976811Abstract: A light emitting device of the present invention includes a light emitting substrate including an insulating substrate, a circuit pattern layer disposed on one surface of the insulating substrate, and at least one light emitting element bonded to the circuit pattern layer, a flat heat pipe mechanism that removes heat from the light emitting substrate, a temperature of which is increased with light emission of the at least one light emitting element, and a cooling unit that cools the flat heat pipe mechanism.Type: GrantFiled: June 5, 2020Date of Patent: May 7, 2024Assignee: DENKA COMPANY LIMITEDInventor: Masahiro Konishi
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Patent number: 11978357Abstract: Disclosed is an ulcer model used to practice a procedure including hemorrhage arrest, the ulcer model including a model main body which includes upper and lower surfaces facing each other and a tubular simulated blood vessel path provided between the upper surface and the lower surface and having an inlet opening and an outlet opening. The upper surface includes a ring-shaped raised surface that rises in a thickness direction of the model main body and a simulated ulcer surface that is a recessed bottom surface surrounded by the raised surface. The simulated blood vessel path extends from a part other than the upper surface of the surfaces of the model main body to the simulated ulcer surface or an area in the vicinity of the inside thereof.Type: GrantFiled: June 28, 2018Date of Patent: May 7, 2024Assignees: Denka Company Limited, Tohoku UniversityInventors: Akira Miyama, Toru Arai, Takashi Sasaki, Takeshi Kanno, Yularo Arata, Atsushi Masamune
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Publication number: 20240141157Abstract: A block copolymer composition contains a block copolymer having a vinyl aromatic hydrocarbon monomer unit and a conjugated diene monomer unit. The block copolymer composition satisfies: when a total of the vinyl aromatic hydrocarbon monomer unit and the conjugated diene monomer unit in the composition is taken as 100 mass %, a content of the conjugated diene monomer unit is 10-20 mass %; the composition contains 60-100 mass % of the block copolymer having a structure represented by (S)-[(S/B)]2 where (S) is a polymer chain of the vinyl aromatic hydrocarbon monomer unit, and (S/B) is a copolymer chain having the vinyl aromatic hydrocarbon monomer unit and the conjugated diene monomer unit; Mn of the block copolymer contained in the composition is 100,000-200,000; and when storage moduli measured at 70° C. and 100° C. in dynamic viscoelasticity measurement are defined as E?70 and E?100, V in V=E?70×(E?70?E?100)/30 is 0.5×1016-2.0×1016.Type: ApplicationFiled: July 1, 2021Publication date: May 2, 2024Applicant: DENKA COMPANY LIMITEDInventors: Soichiro NAKANISHI, Yuya NAKAMURA, Hitomi YAKUNO, Tadashi SAWASATO
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Publication number: 20240145640Abstract: A phosphor plate according to the present invention is a phosphor plate including: a plate-like composite including a base material and a phosphor dispersed in the base material, in which both Ry1 and Ry2 are 5.00 ?m or less, where Ry1 is a maximum height on a front surface of the phosphor plate and Ry2 is a maximum height on a back surface.Type: ApplicationFiled: February 21, 2022Publication date: May 2, 2024Applicant: DENKA COMPANY LIMITEDInventors: Yuki KUBOTA, Taiyo YAMAURA, Kazuhiro ITO
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Patent number: 11973002Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.Type: GrantFiled: November 12, 2020Date of Patent: April 30, 2024Assignee: Denka Company LimitedInventors: Atsushi Sakai, Masaya Yumiba, Kentaro Nakayama, Yoshitaka Taniguchi
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Publication number: 20240132649Abstract: A (meth)acrylate-based block copolymer including a polymer block and a (meth)acrylate-based polymer block, wherein: the (meth)acrylate-based block copolymer contains 5 to 30% by mass of the polymeric block and 70 to 95% by mass of the (meth)acrylate-based polymer block with respect to 100% by mass of the (meth)acrylate-based block copolymer; the polymer block has a monomer unit derived from a monomer; when the monomer is polymerized alone, a polymer with a glass transition temperature of 80° C. or higher can be obtained; and a tensile strength at break measured in accordance with JIS K 6251 of a film obtained by immersion-molding a (meth)acrylate-based block copolymer latex containing the (meth)acrylate-based block copolymer and heat-treating at 130° C. for 30 minutes is 14 MPa or more.Type: ApplicationFiled: March 16, 2022Publication date: April 25, 2024Applicant: DENKA COMPANY LIMITEDInventors: Wataru NISHINO, Yushi KUMAGAI, Ibuki SHIMOTOMAI, Yutaka SAITO
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Patent number: 11965078Abstract: A chloroprene-unsaturated nitrile copolymer composition containing 100 parts by mass of a chloroprene-unsaturated nitrile copolymer having 3 to 20% by mass of a structural unit derived from an unsaturated nitrile monomer, and 0.05 to 2.0 parts by mass of a xanthogen compound.Type: GrantFiled: November 6, 2019Date of Patent: April 23, 2024Assignee: Denka Company LimitedInventors: Suguru Onuki, Wataru Nishino, Atsunori Kondo, Yuhei Ishigaki, Naoki Kobayashi
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Patent number: 11965096Abstract: [Problem] To provide a resin composition that can lead to a biological model, which has a softness and provides a sensation of needle insertion close to those of human blood vessels and/or skin, and a biological model using the same. [Solution] A resin composition containing, with respect to 100 parts by mass of a component (A) hydrogenated block copolymer having a MFR (temperature 230° C., load 2.16 kg) of 1 g/10 min or less: 350 parts by mass or more and 1000 parts by mass or less of a component (B) oil; and 0.01 parts by mass or more and less than 150 parts by mass of a component (C) lubricant. The component (B) oil preferably has a kinematic viscosity of 0.1-100 mm2/s at 37.8° C. or 40° C.Type: GrantFiled: October 25, 2019Date of Patent: April 23, 2024Assignee: DENKA COMPANY LIMITEDInventors: Akira Miyama, Mutsumi Matsumoto
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Publication number: 20240124773Abstract: A phosphor powder containing a phosphor represented by General Formula (I) below. In General Formula (I), M1 includes at least La and optionally further includes one or more elements selected from the group made of lanthanoid elements other than Y and La, M2 includes at least Ba and optionally further includes one or more elements selected from the group made of Mg, Ca, and Sr, x is equal to or more than 0.005 and equal to or less than 0.2, y is equal to or more than 0 and equal to or less than 0.1, and z is more than 0.44 and equal to or less than 0.99: (Eu(1-x)(1-z)M1xM2(1-x)z)2(Si1-yAly)5N8 . . . (I).Type: ApplicationFiled: February 25, 2022Publication date: April 18, 2024Applicant: DENKA COMPANY LIMITEDInventors: Hiroki BANNO, Hiroaki TOYOSHIMA
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Publication number: 20240124697Abstract: A resin composition has a low styrene-based resin content and that has little impact on the environment, wherein the resin composition has good moldability and yields molded articles having excellent tensile moduli and tensile elongations at break; and a molded article composed of the resin composition. The resin composition contains an inorganic filler containing calcium carbonate and a styrene-based resin containing a diene component, wherein the inorganic filler content is 50 mass % or more relative to the overall mass of the resin composition, and as measured in accordance with ASTM-D638, the tensile modulus is 1,000-3,000 MPa, and the tensile elongation at break is 5% or higher.Type: ApplicationFiled: March 24, 2022Publication date: April 18, 2024Applicant: DENKA COMPANY LIMITEDInventors: Eri KAMIMAKI, Daisuke MOTOI, Hirotaka KOBAYASHI